5SGXMA7N3F45I3WN

The 5SGXMA7N3F45I3WN is a Stratix V GX FPGA from Intel, delivered in a high-density 1932-BBGA FCBGA package. It provides a large logic fabric and sizable on-chip memory for designs that require substantial programmable logic, extensive I/O, and industrial-temperature operation.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/O pins, this device targets complex digital processing and high‑integration system designs while operating across an industrial temperature range and a nominal core supply window.

Key Features

• Logic Capacity  622,000 logic elements (cells) to support large, complex FPGA designs and dense logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, lookup tables, and data storage close to the logic fabric.
• I/O Integration  840 programmable I/O pins to interface with high‑pin‑count systems and multiple peripheral domains.
• Power Supply  Core voltage support in the range 820 mV to 880 mV for compatibility with targeted Stratix V power domains.
• Package & Mounting  1932‑BBGA, FCBGA package (supplier package listed as 1932‑FBGA, FC (45×45)); surface‑mount mounting type for board‑level integration.
• Temperature Grade  Industrial grade with an operating temperature range of −40°C to 100°C for hardened environmental performance.
• RoHS Compliance  RoHS‑compliant construction to meet standard lead‑free manufacturing requirements.
• Stratix V GX Family Transceiver Options  Stratix V GX devices are offered with GX transceiver speed grades (family documentation lists GX channel options up to 14.1 Gbps), providing options for high‑speed serial connectivity where required.

Typical Applications

• Large-scale logic integration  Use the device where substantial programmable logic is needed — 622,000 logic elements enable high gate counts and complex custom architectures.
• Memory‑intensive processing  Approximately 51.2 Mbits of embedded RAM supports buffering, packet processing, and on‑chip data handling without external memory for many use cases.
• High‑pin systems and I/O aggregation  With 840 I/O pins, deploy the FPGA as a central I/O hub for multi‑lane interfaces and dense board interconnects.

Unique Advantages

• Highly integrated logic and memory: Combines 622,000 logic elements with ~51.2 Mbits of embedded RAM to reduce external component count and simplify system architecture.
• Extensive I/O capacity: 840 I/O pins support dense connectivity, reducing the need for additional interface chips and enabling direct attachment of multiple subsystems.
• Industrial temperature rating: Rated for −40°C to 100°C operation, providing robustness for industrial environments and extended temperature applications.
• High‑density FCBGA package: The 1932‑BBGA/1932‑FBGA (45×45) package provides a compact, high‑pin‑count solution for space‑constrained boards that require large FPGA capacity.
• Family transceiver options: As part of the Stratix V GX family, transceiver speed grades are available for designs that need high‑speed serial channels (family documentation lists GX channel grades up to 14.1 Gbps).
• RoHS compliant: Aligns with lead‑free manufacturing processes and standard environmental requirements.

Why Choose 5SGXMA7N3F45I3WN?

The 5SGXMA7N3F45I3WN positions itself as a high‑capacity Stratix V GX FPGA for applications requiring large programmable logic, substantial embedded memory, and a high number of I/O connections within an industrial temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on‑chip RAM, and 840 I/Os makes it suitable for system designs that prioritize integration and board‑level consolidation.

Supported by Intel’s Stratix V family documentation and supplied in a high‑density 1932 FCBGA package, this device is appropriate for development teams and procurement looking for a robust FPGA platform that aligns with industrial operating conditions and RoHS requirements.

Request a quote or submit an inquiry for part number 5SGXMA7N3F45I3WN to obtain pricing, lead times, and availability for your project requirements.