5SGXMA7N3F45I4WN

The 5SGXMA7N3F45I4WN is an Intel Stratix® V GX field programmable gate array (FPGA) in a high-density FCBGA package. It integrates a large fabric of logic elements, embedded RAM, and abundant I/O to support complex digital designs.

This device is designed for engineers building high-density, performance-oriented systems that require substantial on-chip memory, large I/O counts, and operation across an industrial temperature range.

Key Features

• High-density logic — 622,000 logic elements provide a large programmable fabric for complex logic, DSP, and custom processing functions.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, large state machines, and memory-intensive algorithms.
• Extensive I/O — 840 user I/Os to interface with high-pin-count systems, mezzanines, and multi-channel peripherals.
• Package and mounting — 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for dense board integration.
• Core voltage — Core supply range of 820 mV to 880 mV, enabling operation at the device’s specified core power rails.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Environmental compliance — RoHS-compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-speed communications — Stratix V GX devices include multi-gigabit transceiver capabilities within the family, making this device suitable for designs requiring high-speed serial connectivity and protocol bridging.
• Compute-intensive signal processing — Large logic capacity and substantial embedded RAM support DSP kernels, packet processing, and real-time data manipulation in hardware.
• Industrial control and automation — Industrial temperature rating and robust I/O count enable deployment in control systems, motor drives, and factory automation where extended temperature operation is required.
• High-density I/O systems — With 840 I/Os and a compact 1932-BBGA package, the device is well suited for applications that require dense board-level connectivity and modular interfacing.

Unique Advantages

• Large programmable fabric: 622,000 logic elements allow designers to implement complex, large-scale logic and state machines without partitioning across multiple devices.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduce dependence on external memory and improve data throughput for buffering and algorithm acceleration.
• High I/O density: 840 I/Os simplify integration with multi-channel front ends, sensors, and high-pin-count interfaces.
• Industrial reliability: Rated operation from –40 °C to 100 °C supports deployments in demanding industrial environments.
• Compact, manufacturable package: 1932-BBGA FCBGA (45×45) surface-mount package enables high-density board layouts while remaining RoHS-compliant.
• Defined core power envelope: Core voltage range of 820 mV–880 mV provides clear power-supply requirements for system design.

Why Choose 5SGXMA7N3F45I4WN?

This Stratix V GX FPGA combines high logic density, substantial embedded memory, and a large I/O complement in a single, industrial-grade FCBGA package. It is well suited to designers requiring a scalable, high-capacity programmable device for communication, signal processing, and industrial applications.

The device’s package, operating range, and RoHS compliance make it a practical choice for production systems where board density, environmental robustness, and supply-chain compliance matter. Its integration of logic, memory, and I/O reduces system complexity and supports long-term platform scalability.

If you require pricing, lead-time, or would like to request a quote for 5SGXMA7N3F45I4WN, submit a request for a quote or pricing inquiry and our team will respond with the requested information.