5SGXMA9K1H40C2N

The 5SGXMA9K1H40C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) device in a 1517-BBGA FCBGA package. It integrates 840,000 logic elements and approximately 53.25 Mbits of embedded memory, with up to 696 I/O pins to support high-density, configurable digital designs. Designed for commercial-grade applications, the device operates from a core supply of 870 mV to 930 mV and across a 0°C to 85°C operating range.

Key Features

• Logic Capacity — 840,000 logic elements for large-scale programmable logic implementation and complex design mapping.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support high-throughput buffering, state storage, and embedded-memory-based functions.
• I/O Density — 696 device I/O pins to accommodate extensive interfacing and multi-channel connectivity.
• Package and Mounting — 1517-BBGA FCBGA package with supplier device package 1517-HBGA (45×45), surface-mount mounting type for compact board integration.
• Power and Voltage — Core voltage supply range of 870 mV to 930 mV for predictable power design and supply planning.
• Commercial Temperature Grade — Rated for operation from 0°C to 85°C to match standard commercial deployment environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-density FPGA implementations — Leverage 840,000 logic elements and substantial embedded memory for large programmable logic functions and prototyping-to-production designs.
• Multi-channel I/O systems — Use the 696 I/Os to consolidate interfaces and manage numerous peripheral connections on a single device.
• Memory-intensive processing — Approximately 53.25 Mbits of on-chip RAM supports buffering, packet processing, and algorithm state storage within the FPGA fabric.

Unique Advantages

• High logic density: 840,000 logic elements enable implementation of complex digital systems without immediate partitioning across multiple devices.
• Significant on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces external memory needs and simplifies board-level design.
• Extensive I/O: 696 I/O pins provide flexibility for diverse interfacing requirements and system integration.
• Compact FCBGA packaging: 1517-BBGA package and 1517-HBGA (45×45) supplier package offer a space-efficient footprint for high-density boards.
• Commercial-grade suitability: Rated for 0°C to 85°C operation to match standard commercial deployments and supply-chain expectations.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and regional material requirements.

Why Choose 5SGXMA9K1H40C2N?

The 5SGXMA9K1H40C2N positions itself as a high-capacity Stratix V GX FPGA option for designers needing substantial logic resources, on-chip memory, and high I/O counts in a compact FCBGA package. Its combination of 840,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 696 I/Os makes it suitable for dense, feature-rich digital designs where board space and integration matter. With a defined commercial temperature range and RoHS compliance, the device supports standard commercial deployments while offering architects clear electrical and package specifications for system design.

Request a quote or submit an inquiry to receive pricing and lead-time information for the 5SGXMA9K1H40C2N.