5SGXMA9K1H40I2N

The 5SGXMA9K1H40I2N is a Stratix® V GX field-programmable gate array (FPGA) IC supplied in a 1517-BBGA (FCBGA) package and rated for industrial operation. Built for designs that require very large logic capacity and substantial embedded memory, the device combines a high count of logic elements, extensive on-chip RAM, and a large programmable I/O complement.

This device is specified for surface-mount assembly, RoHS compliant, and operates over a core supply range of 870 mV to 930 mV with an ambient temperature range of –40 °C to 100 °C, supporting robust deployment in industrial applications.

Key Features

• High Logic Capacity — 840,000 logic elements for implementing large-scale custom logic, complex state machines, and wide parallel datapaths.
• Substantial Embedded Memory — Approximately 53.248 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive processing tasks.
• Extensive I/O — 696 I/O pins to accommodate dense connectivity requirements for high-channel-count interfaces and board-level integration.
• Package & Mounting — 1517-BBGA (FCBGA) / supplier package 1517-HBGA (45×45), surface-mount for compact, high-pin-count board designs.
• Industrial Grade Temperature — Rated for –40 °C to 100 °C to meet demanding thermal environments.
• Core Power — Supported core supply range of 870 mV to 930 mV for defined operating conditions and power planning.
• Standards Compliance — RoHS compliant to support regulated manufacturing and environmental requirements.

Typical Applications

• High-density logic and signal processing systems — Use the large logic element count and on-chip RAM for complex digital signal processing and custom accelerator functions.
• Data plane and protocol bridging — High I/O count enables aggregation and routing of multiple high-channel interfaces on a single FPGA.
• Industrial control and automation — Industrial temperature rating and robust packaging support deployment in factory and process-control equipment.

Unique Advantages

• Large-scale integration: 840,000 logic elements reduce the need for multiple devices, simplifying system architecture and lowering BOM count.
• On-chip memory density: Approximately 53.248 Mbits of embedded RAM supports deep buffering and data-intensive application requirements without external memory.
• High I/O density: 696 I/Os provide flexibility for complex board-level interconnect and multi-channel interface implementations.
• Industrial readiness: –40 °C to 100 °C operating range and surface-mount FCBGA package make the device suitable for harsh-environment installations.
• Regulatory compatibility: RoHS compliance facilitates integration into regulated manufacturing processes.

Why Choose 5SGXMA9K1H40I2N?

The 5SGXMA9K1H40I2N positions itself as a high-capacity Stratix V GX FPGA option for teams designing large, memory-intensive, and I/O-rich systems. Its combination of 840,000 logic elements, approximately 53.248 Mbits of embedded RAM, and 696 I/Os provides the resources needed for complex logic implementations while the industrial temperature rating and FCBGA package support robust deployment scenarios.

This device is suited to engineers and procurement teams building scalable, high-density FPGA-based systems that require long-term reliability and clear device specifications for power, temperature, and packaging.

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