5SGXMA9K1H40C2LG

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 1,293 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMA9K1H40C2LG – Stratix® V GX FPGA, 840,000 logic elements, ~53.25 Mbits RAM, 696 I/Os, 1517-BBGA

The 5SGXMA9K1H40C2LG is an Intel Stratix® V GX field-programmable gate array (FPGA) delivering high logic density and on-chip memory in a commercial-temperature, surface-mount package. As a GX-class Stratix V device, it is designed for designs that require large programmable logic capacity, substantial embedded memory, and a high I/O count for complex system integration.

With 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 696 I/Os, this device targets demanding computational and connectivity use cases where integration, channel density, and routing flexibility matter.

Key Features

  • Core Logic  840,000 logic elements provide extensive programmable resources for large-scale logic, control, and custom hardware acceleration.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, on-device data storage, and memory-intensive algorithms.
  • I/O Density  696 I/Os enable high channel counts and flexible interfacing options for parallel and serial connectivity.
  • Package & Mounting  1517-BBGA (FCBGA) package; supplier device package 1517-HBGA (45×45); surface-mount mounting for PCB integration.
  • Power  Core supply range specified at 820 mV to 880 mV to match platform power planning and voltage-rail design.
  • Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
  • Regulatory  RoHS compliant for environmental and manufacturing compliance requirements.

Typical Applications

  • High-density programmable logic  Large-scale logic implementations and hardware-accelerated functions that require a high count of logic elements and embedded memory.
  • High-channel I/O systems  Boards and systems that need many external interfaces or parallel I/O channels, leveraging the 696 available I/Os.
  • Custom compute and DSP  On-device memory and extensive logic resources for signal processing kernels, streaming pipelines, and custom accelerators.
  • Prototype and advanced FPGA development  Platform-level FPGA designs where density, integration, and flexibility are priorities during development and verification.

Unique Advantages

  • High logic density: 840,000 logic elements enable integration of large digital designs on a single device, reducing board-level component count.
  • Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM supports deep buffering and on-chip data structures without immediate external memory needs.
  • Extensive I/O count: 696 I/Os simplify complex system interconnects and reduce the need for external multiplexing or IO expansion.
  • Commercial-grade thermal range: Rated 0 °C to 85 °C for deployments in standard commercial environments and controlled enclosures.
  • Compact, surface-mount package: 1517-BBGA (1517-HBGA supplier package, 45×45) provides a dense physical footprint suitable for PCB integration.
  • RoHS compliant: Meets environmental compliance requirements for manufacturing and supply chain considerations.

Why Choose 5SGXMA9K1H40C2LG?

The 5SGXMA9K1H40C2LG positions itself as a high-density, commercial-grade Stratix V GX FPGA option for designs that need extensive programmable logic, significant on-chip memory, and a high I/O complement in a compact FCBGA package. Its specified core voltage range and surface-mount package simplify power and board design for medium- to large-scale FPGA implementations.

This device is well suited to engineering teams building compute-heavy, I/O-rich systems where integrating large amounts of logic and memory on a single device reduces system complexity and BOM count. Intel’s Stratix V GX family device characteristics provide a clear development path for projects requiring scalable programmable-capacity within commercial temperature operation.

Request a quote or submit a pricing inquiry to receive availability, lead-time, and quantity pricing for the 5SGXMA9K1H40C2LG.

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