5SGXMA7N3F45I4N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 833 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N3F45I4N – Stratix® V GX FPGA, 622,000 logic elements

The 5SGXMA7N3F45I4N is a Stratix® V GX field-programmable gate array (FPGA) device in a 1932-BBGA FCBGA package. It provides a high-density programmable logic fabric combined with substantial on-chip RAM and a large I/O count for complex, system-level digital designs.

Designed and specified for industrial-grade operation, this device is suited to designs that require large logic capacity, plentiful embedded memory, and a high number of I/Os within a single-socket, surface-mount package.

Key Features

  • Core logic  622,000 logic elements for implementing large-scale digital designs and complex algorithmic functions.
  • Embedded memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, lookup tables, and memory-intensive processing.
  • I/O capability  840 I/Os to support dense external interfacing and multi-channel connectivity.
  • Package & mounting  1932-BBGA (FCBGA) supplier device package 1932-FBGA, FC (45×45); surface-mount mounting for compact board integration.
  • Power supply  Core voltage supply range 820 mV to 880 mV for targeted power rail design and supply planning.
  • Temperature & grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
  • Standards compliance  RoHS compliant, meeting common environmental and materials requirements for lead-free assemblies.
  • Documentation coverage  Device datasheet provides electrical and switching characteristics, including operating conditions and I/O timing information for system-level design.

Typical Applications

  • High-density digital processing  Use the large logic element count and abundant embedded RAM to implement compute-heavy functions and algorithm acceleration.
  • Complex I/O systems  Leverage 840 I/Os for multi-channel data aggregation, protocol bridging, or dense peripheral interfacing.
  • Industrial and ruggedized equipment  Industrial-grade operation and −40 °C to 100 °C temperature range enable deployment in extended-temperature control and instrumentation systems.
  • Board-level space-constrained designs  The 1932-BBGA FCBGA surface-mount package consolidates high function density into a compact footprint for space-sensitive applications.

Unique Advantages

  • High logic capacity: 622,000 logic elements provide the boolean and routing resources needed for large, integrated digital functions.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Extensive I/O count: 840 I/Os simplify system integration by supporting many external channels without adding multiplexing complexity.
  • Industrial temperature rating: Rated for −40 °C to 100 °C to support deployment in environments that require extended-temperature operation.
  • Compact, high-pin-count package: 1932-BBGA (FCBGA) packaging enables high pin density and reliable surface-mount assembly in compact designs.
  • RoHS compliant: Meets lead-free material requirements for environmentally conscious manufacturing and compliance needs.

Why Choose 5SGXMA7N3F45I4N?

The 5SGXMA7N3F45I4N combines significant programmable logic resources, extensive on-chip memory, and a high I/O count in a single industrial-grade FCBGA package. This combination makes it suitable for designs that require dense integration of digital logic and memory while maintaining a compact board footprint and extended-temperature operation.

Engineers and system designers seeking a verified Stratix V GX device with clear electrical and timing documentation will find this part appropriate for complex, high-capacity FPGA implementations where on-chip resources and robust operating range are primary considerations.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the 5SGXMA7N3F45I4N.

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