5SGXMA7N3F45I3NCV

The 5SGXMA7N3F45I3NCV is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers very high logic capacity and embedded memory in a 1932-ball FCBGA package for surface-mount PCB assembly.

Designed for demanding, industrial-temperature applications, this device targets designs requiring large logic capacity, significant on-chip RAM, and a high I/O count while operating at a low core voltage range.

Key Features

• Logic Capacity — 622,000 logic element cells for complex programmable logic and large-scale integration.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support large buffering, packet processing, and memory-intensive logic functions.
• I/O Density — 840 user I/Os to support extensive external connectivity and parallel interfacing.
• Transceiver Family Support — As a Stratix V GX device, the series includes transceiver speed grades (series-level) up to 14.1 Gbps; consult the Stratix V device documentation for speed-grade details.
• Power — Core voltage supply range of 820 mV to 880 mV to match low-voltage FPGA power domains.
• Package & Mounting — 1932-BBGA (FCBGA) supplier device package: 1932-FBGA, FC (45×45 mm); surface-mount mounting type for high-density board designs.
• Operating Environment — Industrial temperature grade with an operating range of −40 °C to 100 °C for extended-temperature deployments.
• Compliance — RoHS compliant.

Typical Applications

• High-speed data and communications systems — Large logic and embedded RAM combined with Stratix V GX transceiver capabilities suit high-throughput packet processing and line-rate interface implementations.
• Network and telecom infrastructure — High I/O count and dense logic enable complex protocol handling, framing, and buffering within switching and routing platforms.
• Compute and acceleration modules — Substantial logic and memory resources allow hardware acceleration of algorithms and datapath offload in compute appliances.
• Industrial control and instrumentation — Industrial temperature rating and robust packaging support deployment in demanding environmental conditions requiring deterministic logic control.

Unique Advantages

• Large programmable fabric: 622,000 logic element cells provide headroom for complex designs and system-on-chip style integration.
• Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for buffering and state storage.
• Extensive I/O: 840 user I/Os enable dense connectivity to peripherals, transceivers, and parallel interfaces without external multiplexing.
• Industrial temperature capability: −40 °C to 100 °C operation supports deployment in harsh or extended-temperature environments.
• Compact, high-density package: 1932-ball FCBGA (45×45 mm) provides high pin-count routing in a single package for space-constrained PCBs.
• Low core-voltage operation: 0.82–0.88 V supply compatibility aligns with modern low-voltage power rails for efficient system power design.

Why Choose 5SGXMA7N3F45I3NCV?

This Stratix V GX device combines very large logic capacity, substantial embedded RAM, and a high I/O count in a single industrial-grade FCBGA package. It is well suited to engineers building high-throughput, memory-intensive, and I/O-rich systems that must operate across an extended temperature range.

For design teams that require scalability and the performance characteristics of the Stratix V family, this device offers a platform-level feature set that supports advanced protocol handling, data-path acceleration, and dense system integration while meeting RoHS requirements.

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