5SGXMA7N3F45I4G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 1,186 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N3F45I4G – Stratix® V GX FPGA (High-density, Industrial-grade)

The 5SGXMA7N3F45I4G is an Intel Stratix V GX Field Programmable Gate Array (FPGA) supplied in a 1932-BBGA FCBGA package. It delivers large on-chip logic and memory resources alongside a substantial I/O count, making it suitable for demanding industrial applications that require high integration and extended temperature operation.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory and 840 user I/Os, this device targets designs that need high-density programmable logic, significant embedded storage, and broad interfacing capability within a compact surface-mount package.

Key Features

  • Core & Logic  622,000 logic elements for high-density programmable logic and complex digital designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, state machines and local data storage.
  • I/O Capacity  840 user I/Os to accommodate extensive external interfacing and system-level connectivity.
  • Power Supply  Core supply range of 820 mV to 880 mV for the device core voltage domain.
  • Package & Mounting  1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45), designed for surface-mount assembly.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40°C to 100°C for use in extended-temperature environments.
  • Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

  • Industrial Control Systems  High logic density and extended temperature range support complex control algorithms and robust field deployment.
  • High-throughput Data Processing  Large on-chip RAM and extensive logic resources enable buffering and parallel processing for data-centric applications.
  • Signal Processing and Acceleration  Substantial logic and memory allow implementation of custom accelerators and DSP pipelines within the FPGA fabric.
  • Complex I/O and Interface Bridging  840 I/Os simplify integration with multiple peripherals, sensors and external subsystems in compact system designs.

Unique Advantages

  • Highly integrated logic and memory: 622,000 logic elements combined with approximately 51.2 Mbits of embedded RAM reduce the need for external components and simplify system architecture.
  • Broad system interfacing: 840 user I/Os enable rich peripheral connectivity and flexible board-level integration.
  • Industrial temperature range: Rated for −40°C to 100°C operation to support deployment in temperature-challenging environments.
  • Compact, surface-mount FCBGA package: 1932-BBGA/1932-FBGA packaging provides high density in a board-level footprint optimized for modern assemblies.
  • Low-voltage core operation: 820 mV to 880 mV supply range for the core domain, enabling designs that target optimized power rails.
  • Regulatory readiness: RoHS compliance helps meet lead-free manufacturing requirements.

Why Choose 5SGXMA7N3F45I4G?

The 5SGXMA7N3F45I4G positions itself as a high-density, industrial-grade Stratix V GX FPGA that balances large programmable logic resources, significant embedded memory and a high I/O count within a compact FCBGA package. These characteristics make it well suited for developers and systems integrators building complex, reliability-focused designs that require substantial on-chip resources and robust thermal performance.

For projects that demand scalability of logic and memory, extensive peripheral connectivity and compliance with RoHS and industrial temperature requirements, this device provides a clear, specification-driven foundation for both prototype and production deployments.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 5SGXMA7N3F45I4G into your next design.

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