5SGXMA7N3F45I3LN

The 5SGXMA7N3F45I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. The device provides 622,000 logic elements and approximately 51.2 Mbits of embedded memory in a high-density package.

Built for high-pin-count, industrial-grade designs, the device offers 840 I/O pins, a surface-mount 1932-BBGA (FCBGA) package, and an operating range from −40 °C to 100 °C. As part of the Stratix V GX family, the series includes transceiver speed-grade options up to 14.1 Gbps in certain grades (refer to the device datasheet for grade-specific transceiver capabilities).

Key Features

• Logic Capacity — 622,000 logic elements to implement complex digital functions and large-scale designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Density — 840 I/O pins to support dense peripheral, memory, and multi-channel interfaces.
• Power and Core Voltage — Core supply range from 820 mV to 880 mV for device operation within specified voltage margins.
• Package & Mounting — 1932-BBGA (FCBGA) surface-mount package; supplier package listed as 1932-FBGA, FC (45×45) for compact, high-density board integration.
• Temperature & Grade — Industrial grade with operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement complex algorithms and large-scale logic using 622,000 logic elements and substantial on-chip RAM.
• High-pin-count system interfaces — Use the 840 I/O pins for multi-channel connectivity, external memory interfaces, and dense peripheral integration.
• Industrial systems — Industrial-grade temperature range (−40 °C to 100 °C) suits deployments that require extended thermal tolerance.
• High-speed serial applications — As a Stratix V GX family device, the series supports high-speed transceiver options (up to 14.1 Gbps in certain speed grades); consult the datasheet for grade-specific transceiver capabilities.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board count and BOM complexity.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduce external memory dependency and improve data throughput for buffering and streaming tasks.
• Extensive I/O connectivity: 840 I/Os provide the flexibility to interface with many peripherals and parallel interfaces without multiplexing compromises.
• Industrial readiness: Rated for −40 °C to 100 °C operation and listed as industrial grade for designs that require wider temperature margins.
• Compact, high-density package: 1932-BBGA (FCBGA) package supports high-pin-count routing in a 45×45 supplier footprint for space-constrained boards.
• RoHS compliant: Meets RoHS requirements for environmental and manufacturing considerations.

Why Choose 5SGXMA7N3F45I3LN?

The 5SGXMA7N3F45I3LN combines very large logic capacity, significant on-chip memory, and a high I/O count in a single industrial-grade Stratix V GX device. These characteristics make it well suited for designs that demand dense logic, ample local RAM, and extensive external connectivity while operating across a wide temperature range.

As a member of the Stratix V GX family, the device aligns with a documented set of electrical and switching characteristics for the series and supports family-level transceiver speed-grade options. Choose this part when you need a high-capacity, industrial-grade FPGA with a compact, high-pin-count package and verifiable electrical specifications.

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