5SGXMA7N3F45I3LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 313 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N3F45I3LG – Stratix® V GX FPGA IC, 840 I/Os, 622,000 Logic Elements
The 5SGXMA7N3F45I3LG is a Stratix V GX field programmable gate array (FPGA) in a 1932‑BBGA FCBGA package, offering high logic density and extensive I/O integration for demanding designs. With approximately 622,000 logic elements and roughly 51.2 Mbits of embedded memory, this industrial‑grade device targets designs that require large on‑chip logic and memory capacity along with broad external connectivity.
Specified for surface mount assembly and an industrial operating temperature range of −40 °C to 100 °C, the device operates from a core supply between 820 mV and 880 mV and provides 840 I/Os to support complex board-level interfacing and system integration.
Key Features
- High Logic Density — Approximately 622,000 logic elements to implement large, complex digital designs and custom hardware accelerators.
- Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for buffering, state storage, and high‑performance data paths.
- Extensive I/O — 840 I/Os to support broad connectivity across peripherals, high‑speed interfaces, and multi‑lane systems.
- Transceiver Capability (Stratix V GX) — The Stratix V GX family supports GX channel transceiver speed grades up to 14.1 Gbps depending on speed grade, as documented in the Stratix V device datasheet.
- Power and Core Supply — Core voltage range from 820 mV to 880 mV to match system power architectures and optimize performance within specified operating conditions.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature‑sensitive industrial applications.
- Package and Mounting — 1932‑BBGA (FCBGA) package, supplier package listed as 1932‑FBGA, FC (45 × 45), designed for surface mount assembly.
- RoHS Compliant — Conforms to RoHS environmental requirements.
Typical Applications
- High‑density FPGA designs — Use the large logic element count and embedded memory to consolidate complex digital functions and hardware accelerators on a single device.
- High‑bandwidth communications — Leverage the Stratix V GX transceiver capabilities and abundant I/Os for multi‑lane links and board‑level networking interfaces.
- Compute and data processing — Implement dataflow pipelines and buffering using the device’s sizable on‑chip RAM and logic resources for compute‑intensive tasks.
- Industrial systems — Deploy in temperature‑sensitive industrial environments where the −40 °C to 100 °C operating range and RoHS compliance are required.
Unique Advantages
- Large on‑chip resources: High logic element count and approximately 51.2 Mbits of embedded memory reduce reliance on external components and simplify system architecture.
- Broad external connectivity: 840 I/Os enable flexible interfacing across diverse peripherals and high‑pin‑count board designs.
- Transceiver support: Stratix V GX transceiver speed grades (documented up to 14.1 Gbps) enable implementation of high‑speed serial links where needed.
- Industrial readiness: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package for surface mount assembly in industrial applications.
- Power‑defined core operation: Narrow core supply window (820 mV–880 mV) supports predictable core performance and power planning.
- Standards‑aligned manufacturing: RoHS compliance supports regulatory and environmental requirements for production.
Why Choose 5SGXMA7N3F45I3LG?
The 5SGXMA7N3F45I3LG positions itself as a high‑density Stratix V GX FPGA suitable for designs that demand abundant logic, sizeable on‑chip RAM, and extensive I/O capacity. Its industrial temperature rating and FCBGA package make it a practical choice for systems requiring robust operation across a wide thermal range.
Engineers designing complex digital systems, high‑bandwidth communications equipment, or compute‑oriented FPGA implementations will find the device’s combination of logic resources, memory, and I/O count beneficial for consolidating functions and simplifying board-level design.
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