5SGXMA7N3F45C3WN

The 5SGXMA7N3F45C3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1932-BBGA, FCBGA package designed for high-density, high‑I/O designs. It delivers 622,000 logic elements and approximately 51.2 Mbits of embedded memory to support complex digital designs.

With 840 I/Os, a core supply range of 820 mV to 880 mV, and commercial operating temperature from 0 °C to 85 °C, this surface-mount device targets demanding applications that require large on-chip resources and high interconnect capacity while maintaining commercial-grade operating conditions.

Key Features

• Core and Logic: 622,000 logic elements and 234,720 logic blocks provide substantial programmable fabric for large-scale digital integration and parallel processing.
• Embedded Memory: Approximately 51.2 Mbits of on-chip RAM to store intermediate data, buffers, and state with tight physical proximity to logic.
• I/O Capacity: 840 I/O pins to support high-density board-level connectivity and multiple parallel interfaces.
• Power Supply: Core voltage supply range of 820 mV to 880 mV to match low-voltage FPGA core requirements.
• Package & Mounting: 1932‑BBGA (FCBGA) package, supplier package listed as 1932‑FBGA, FC (45×45); surface mount mounting type for compact, high‑pin‑count board designs.
• Operating Conditions: Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant: Meets RoHS requirements for environmental compliance.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of large functions into a single device, reducing board-level complexity.
• Large embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O resources: 840 I/Os support broad peripheral and interface integration without immediate need for external multiplexing.
• Compact, high-pin‑count package: 1932‑BBGA/FCBGA footprint provides a high pin count in a compact form factor suitable for dense PCBs.
• Low-voltage core operation: 820–880 mV core supply supports designs targeting low-voltage FPGA cores.
• Commercial-grade operation: Rated 0 °C to 85 °C for projects requiring commercial temperature operation.

Why Choose 5SGXMA7N3F45C3WN?

The 5SGXMA7N3F45C3WN combines substantial programmable logic, significant embedded memory, and very high I/O capacity in a compact FCBGA package, making it well suited for designs that require consolidation of complex digital functions onto a single FPGA. Its low-voltage core range and commercial temperature rating align with modern FPGA power architectures and commercial product requirements.

As a Stratix V GX device, it is positioned for customers who need high-density on-chip resources and high interconnect counts. Selecting this device can simplify board design by reducing external components and providing headroom for complex logic and memory needs while maintaining RoHS compliance.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXMA7N3F45C3WN for your next design.