5SGXMA7N3F40I4WN

The 5SGXMA7N3F40I4WN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable fabric with a large embedded memory complement and extensive I/O in a 1517-BBGA (FCBGA) package for industrial designs.

This device is targeted at systems that require substantial logic resources, significant on-chip memory, and large I/O counts while operating across an industrial temperature range; it features a low-voltage core supply and family-level transceiver capabilities described in the Stratix V device datasheet.

Key Features

• Core Logic  622,000 logic elements (cells) deliver high logic capacity for complex FPGA designs and large state machines.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, or algorithmic data storage.
• I/O Density  600 user I/O pins to support wide parallel interfaces, multiple peripherals, or high-channel-count designs.
• Power Supply  Core voltage supply specified at 820 mV to 880 mV for the device core.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package noted as 1517-FBGA (40×40). Surface-mount mounting type simplifies PCB assembly for production.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Standards & Compliance  RoHS compliant.
• Family Transceiver Capability (Series-level)  As a Stratix V GX device, the family datasheet describes multi-gigabit transceiver channel options and core/transceiver speed grades for high-speed serial I/O (see Stratix V documentation for details).

Typical Applications

• High-performance networking  High logic density and large embedded RAM make this FPGA suitable for packet processing, switching, and other network infrastructure tasks that require many I/Os and on-chip buffering.
• Signal processing and acceleration  Large logic and memory resources enable implementation of hardware-accelerated DSP blocks, protocol offloads, and compute pipelines.
• Industrial systems  Industrial temperature rating and surface-mount FCBGA packaging support deployment in factory automation, instrumentation, and rugged control applications.
• Multi‑interface systems  A high I/O count supports complex interface aggregation, custom front-ends, and heterogeneous connectivity on a single device.

Unique Advantages

• Substantial logic capacity: 622,000 logic elements provide the room to integrate multiple functions or large custom architectures on a single FPGA.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage, simplifying board design.
• High I/O count: 600 I/Os enable broad connectivity options and support for parallel buses, multiple peripherals, or multi‑lane interfaces.
• Industrial temperature range: Rated from −40 °C to 100 °C for use in environments requiring extended thermal performance.
• Low-voltage core: Core supply specified between 820 mV and 880 mV, consistent with modern FPGA core voltage requirements for power-managed systems.
• RoHS compliant: Meets lead‑free and restricted-substance requirements for contemporary electronics production.

Why Choose 5SGXMA7N3F40I4WN?

The 5SGXMA7N3F40I4WN brings high logic density, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GX FPGA package. Its specifications make it well suited for designers who need a single, programmable device to consolidate functions, accelerate algorithms, and interface with numerous peripherals while operating across a wide temperature range.

Customers designing industrial, networking, or compute-accelerated systems will find the device’s combination of capacity, memory, and I/O beneficial for scalable, long‑lifecycle deployments backed by the Stratix V device family documentation.

Request a quote or submit a procurement inquiry to evaluate 5SGXMA7N3F40I4WN for your next high-density FPGA design project.