5SGXMA7N3F40I3N

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 817 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N3F40I3N – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 622,000 logic elements

The 5SGXMA7N3F40I3N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade. It provides a large programmable fabric with 622,000 logic elements and approximately 51 Mbits of on-chip RAM, alongside 600 user I/O pins, enabling high-density digital integration in compact surface-mount packaging.

This device targets designs that require substantial logic capacity, extensive embedded memory, and a high I/O count while operating across an industrial temperature range and a low-voltage core supply.

Key Features

  • Programmable Logic  622,000 logic elements (cells) for large-scale implemented logic and custom digital processing.
  • Embedded Memory  Approximately 51 Mbits of total on-chip RAM for buffering, packet storage, or state retention close to logic.
  • I/O Density  600 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and extensive board-level routing.
  • Power Supply  Core voltage supply specified between 820 mV and 880 mV, providing the device’s required low-voltage core operating range.
  • Industrial Temperature Grade  Qualified for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
  • Package & Mounting  Supplied in a 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40) and designed for surface-mount assembly.
  • Standards Compliance  RoHS compliant to meet regulatory requirements for restricted substances.

Typical Applications

  • Industrial Control  Large logic capacity and industrial temperature rating make the device suitable for control systems that require on-board processing and rugged operation.
  • High‑Density I/O Systems  With 600 I/Os, the device supports high-channel-count interfacing for data acquisition, instrumentation, and multiport communications.
  • Embedded Memory‑Intensive Designs  Approximately 51 Mbits of embedded RAM enable buffering and local data storage for packet processing, frame buffering, or algorithm state.

Unique Advantages

  • Substantial Logic Capacity:  622,000 logic elements provide headroom for complex state machines, datapaths, and custom accelerators within a single FPGA.
  • Large Embedded Memory:  Approximately 51 Mbits of on-chip RAM reduces the need for external memory in many applications, simplifying board design.
  • High I/O Count:  600 available I/O pins enable dense connectivity and flexible interface options without multiplexing compromises.
  • Industrial‑Grade Operation:  Rated for −40 °C to 100 °C operation to meet environmental demands of industrial deployments.
  • Compact Surface‑Mount Package:  1517-BBGA (FCBGA) format in a 1517-FBGA (40×40) supplier package supports high-density PCB layouts and automated assembly.
  • Regulatory Compliance:  RoHS compliance supports regulatory and environmental requirements for modern electronics manufacturing.

Why Choose 5SGXMA7N3F40I3N?

The 5SGXMA7N3F40I3N is a Stratix V GX FPGA that combines large logic capacity, significant on-chip RAM, and a very high I/O count in a surface-mount FCBGA package. Its industrial temperature rating and low-voltage core supply range make it appropriate for demanding embedded systems that require both density and environmental robustness.

This part is well suited to engineers and procurement teams designing systems that need integrated memory and extensive I/O within a compact board footprint while maintaining factory-level compliance (RoHS) and industrial‑grade operating range.

Request a quote or submit a purchasing inquiry for the 5SGXMA7N3F40I3N to evaluate its fit for your next industrial FPGA design.

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