5SGXMA7N3F40I3LN

The 5SGXMA7N3F40I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density, programmable digital logic. It integrates a large logic fabric, extensive on-chip memory, and a high count of I/O pins in a 1517‑ball FCBGA package to support complex system integration.

With industrial-grade operating range and RoHS compliance, this device targets designs that require substantial logic capacity, large embedded RAM, and significant external I/O connectivity while maintaining a compact, surface-mount form factor.

Key Features

• Logic Capacity — 622,000 logic elements and 234,720 LABs (logic array blocks) provide a high-density programmable fabric for complex digital functions.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for large buffering, lookup tables, and state storage.
• I/O Resources — 600 I/O pins to support extensive peripheral, board-level, and system interconnect requirements.
• Package & Mounting — 1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40); surface-mount mounting simplifies PCB integration in compact designs.
• Power — Core voltage supply specification of 820 mV to 880 mV for the device core domain.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Use the large logic fabric for implementing complex state machines, datapaths, and custom accelerators.
• On-chip buffering and memory management — Leverage approximately 51.2 Mbits of embedded RAM for large FIFOs, packet buffering, or lookup tables.
• I/O-intensive system controllers — 600 I/O pins accommodate broad peripheral and board-level interfacing requirements.

Unique Advantages

• Substantial logic resources: 622,000 logic elements and 234,720 LABs enable integration of large, functionally rich designs into a single device.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency for many buffering and state-storage needs.
• High I/O count: 600 I/Os support extensive connectivity without needing additional bridge logic, simplifying board-level design.
• Industrial temperature rating: −40 °C to 100 °C operating range suits deployments where extended temperature tolerance is required.
• Compact FCBGA package: 1517‑BBGA (1517‑FBGA, 40×40) offers a high-pin-count solution in a surface-mount form factor for dense PCB layouts.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5SGXMA7N3F40I3LN?

The 5SGXMA7N3F40I3LN combines large-scale programmable logic, significant embedded memory, and a high I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding designs that require robustness and regulatory alignment.

This device is well suited for engineering teams targeting consolidation of complex digital functions, on-chip memory-intensive tasks, and dense I/O integration into a single FPGA. Its specification profile supports scalable, long-term designs where integration density and operational temperature range are important selection criteria.

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