5SGXMA7N3F40I3LG

The 5SGXMA7N3F40I3LG is a Stratix V GX Field Programmable Gate Array from Intel, delivered in a 1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40 × 40). It provides a high-density programmable logic fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded memory for complex system integration.

Offered in an industrial temperature grade and RoHS-compliant, this device supports designs that require large I/O counts (600 I/O), robust thermal range (–40 °C to 100 °C), and a core supply operating range of 820 mV to 880 mV. As part of the Stratix V GX family, the series includes transceiver speed grade offerings documented in the device datasheet.

Key Features

• Core & Logic  622,000 logic elements to implement large, complex programmable logic designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for large buffering, packet processing, or state storage.
• I/O Capacity  Up to 600 I/O pins to support wide parallel interfaces and dense board-level connectivity.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package specified as 1517-FBGA (40 × 40); surface-mount device.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail planning.
• Thermal & Grade  Industrial temperature operation from –40 °C to 100 °C; RoHS compliant.
• Stratix V GX Series Transceiver Options  The Stratix V GX family is offered in transceiver speed grades that include GX channel rates documented at 14.1 Gbps, 12.5 Gbps, and 8.5 Gbps in the device series datasheet.

Typical Applications

• High-density programmable logic systems  Designs that require extensive combinational and sequential logic resources and large embedded memory.
• I/O-intensive platforms  Systems needing up to 600 I/O pins for wide parallel buses, multi-channel interfacing, or board-level expansion.
• Industrial embedded equipment  Applications that require an industrial temperature grade (–40 °C to 100 °C) and surface-mount packaging.

Unique Advantages

• High programmable density: 622,000 logic elements enable consolidation of complex subsystems into a single FPGA device.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffers, tables, and packet/data processing functions.
• Large I/O capability: Up to 600 I/O pins provide flexibility for interfacing multiple peripherals, buses, and mezzanine connectors.
• Industrial operating range: Rated for –40 °C to 100 °C operation, suitable for demanding embedded and industrial environments.
• Robust packaging: 1517-BBGA (1517-FBGA supplier package) in a surface-mount form factor for high-density PCB assembly.
• Series-level transceiver options: Stratix V GX family transceiver speed grades are documented for high-speed serial channel usage in the series datasheet.

Why Choose 5SGXMA7N3F40I3LG?

The 5SGXMA7N3F40I3LG combines a high count of logic elements and substantial embedded memory with extensive I/O and industrial temperature capability, making it suited for large-scale programmable logic implementations in embedded and industrial systems. Its packaging and electrical characteristics support integration into complex board-level designs where density and thermal performance matter.

This device is appropriate for engineers and system designers who need a high-density Stratix V GX FPGA—providing scalability within the Stratix V family and the documented series-level transceiver options referenced in the datasheet for designs that may require high-speed serial channels.

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