5SGXMA7N3F40C4N

The 5SGXMA7N3F40C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering high logic density and substantial on-chip memory for complex programmable designs. It combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory to support large, stateful digital functions and buffering.

Packaged in a 1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40) and specified for commercial operation (0 °C to 85 °C), this surface-mount device provides up to 600 I/O pins and a core supply range of 820 mV to 880 mV for designers targeting dense, I/O-rich FPGA implementations.

Key Features

• Core Architecture — Stratix® V GX FPGA family device optimized for high-density programmable logic and embedded memory capacity.
• Logic Capacity — 622,000 logic elements supported by 234,720 logic array blocks (LABs) for implementing large-scale digital designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for large buffers, FIFOs, and local storage requirements.
• I/O — Up to 600 user-accessible I/O pins to support extensive external interfacing and multi-channel connectivity.
• Power Supply — Core voltage supply specified from 820 mV to 880 mV, enabling precise power design for the FPGA core.
• Package & Mounting — 1517-BBGA FCBGA package (supplier: 1517-FBGA, 40×40); surface-mount construction suitable for modern PCB assembly.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Complex digital systems — Use the large logic capacity and embedded RAM for advanced state machines, protocol engines, and custom processors.
• Memory-intensive processing — Approximately 51.2 Mbits of on-chip memory supports buffering, packet handling, and data staging without relying solely on external memory.
• I/O-dense interfaces — Up to 600 I/O pins enable multi-channel sensor interfaces, wide parallel buses, or multi-protocol front-ends.
• High-integration FPGA designs — The FCBGA package and surface-mount mounting simplify integration into compact, high-density PCBs.

Unique Advantages

• High logic density: 622,000 logic elements allow implementation of large, consolidated designs that reduce the need for multiple devices.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM minimizes external memory dependence for many buffering and storage tasks.
• Extensive I/O resources: 600 I/O pins support complex external connectivity and system-level integration without extensive multiplexing.
• Compact package: 1517-BBGA FCBGA (40×40) provides a high-pin-count solution in a compact footprint for space-constrained assemblies.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation to meet general commercial product requirements and environments.
• Regulatory readiness: RoHS compliance eases environmental and manufacturing considerations.

Why Choose 5SGXMA7N3F40C4N?

The 5SGXMA7N3F40C4N positions itself as a high-density Stratix® V GX FPGA option for designers requiring a combination of large logic capacity, significant embedded memory, and extensive I/O in a compact FCBGA package. Its commercial-grade operating range, RoHS compliance, and specified core voltage range make it suitable for demanding programmable logic applications where integration and on-chip resources are priorities.

This device is well suited for engineering teams implementing large, consolidated FPGA designs that benefit from substantial on-chip RAM and numerous I/O points, offering scalability and design consolidation while aligning with common commercial manufacturing requirements.

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