5SGXMA7N3F40C4

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 62 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N3F40C4 – Stratix V GX FPGA, 622,000 Logic Elements, ~51.2 Mbits RAM, 600 I/Os

The 5SGXMA7N3F40C4 is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA (1517-FBGA, 40×40) package. It provides high-density programmable logic and extensive I/O in a commercial-grade, surface-mount package.

This device is positioned for designs that require large on-chip logic capacity, substantial embedded memory, and a high I/O count while operating within a standard commercial temperature range and a low core voltage supply.

Key Features

  • Core Architecture: Stratix V GX FPGA family — series-level electrical and switching characteristics (including transceiver and I/O timing) are documented in the device datasheet.
  • Logic Capacity: 622,000 logic element cells for high-density programmable logic integration.
  • Embedded Memory: Approximately 51.2 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
  • I/O Count: 600 user I/Os to support complex interfacing and multi-channel designs.
  • Package and Mounting: 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40), surface mount for compact board integration.
  • Supply Voltage: Core supply range from 820 mV to 880 mV to match targeted power rails and core requirements.
  • Operating Temperature: Commercial grade operation from 0 °C to 85 °C.
  • Regulatory Compliance: RoHS compliant.

Unique Advantages

  • High Logic Density: 622,000 logic elements enable complex RTL implementations and large-scale IP integration without immediate need for multiple devices.
  • Substantial On-Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
  • Extensive I/O Resources: 600 I/Os allow broad peripheral connectivity and multi-channel interfacing from a single FPGA package.
  • Compact, Production-Ready Package: 1517-FBGA (40×40) surface-mount package supports dense PCB layouts while maintaining standardized handling for manufacturing.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for typical commercial deployments.
  • Documented Electrical Characteristics: The device family datasheet provides detailed electrical, transceiver, and I/O timing information to support design validation and integration.

Why Choose 5SGXMA7N3F40C4?

The 5SGXMA7N3F40C4 combines substantial logic capacity, large on-chip memory, and a high number of I/Os in a single commercial-grade Stratix V GX FPGA package. Its documented electrical characteristics and transceiver/I/O timing data support rigorous system design and validation.

This part is suited for engineers and procurement teams targeting high-density programmable logic, significant embedded memory, and wide I/O capability within commercial-temperature products. The combination of package density, power supply specification, and RoHS compliance makes it a practical choice where integration and space efficiency are important.

Request a quote or submit a parts inquiry to receive pricing and availability information for the 5SGXMA7N3F40C4.

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