5SGXMA7N3F40C3

The 5SGXMA7N3F40C3 is a Stratix V GX family FPGA offered in a 1517-BBGA FCBGA package for surface-mount applications. It delivers very large programmable logic capacity and extensive I/O, making it suitable for designs that require high integration and significant on‑chip memory.

This device is provided as a commercial-grade FPGA with documented electrical and switching characteristics in the Stratix V device documentation. Key device parameters include a supply voltage range of 820 mV–880 mV and an operating temperature range of 0 °C–85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  Approximately 622,000 logic elements (cells) to support large, complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and DSP data paths.
• I/O Density  Up to 600 user I/O pins to accommodate high-pin-count interfaces and multi-channel designs.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package designed for surface-mount PCB assembly.
• Power and Voltage  Core supply operating window from 820 mV to 880 mV to match system power rails and regulator designs.
• Commercial Grade Temperature  Rated for 0 °C to 85 °C operation for commercial applications.
• Standards Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• High-density programmable logic  Designs that require hundreds of thousands of logic elements and extensive interconnect capacity.
• Large I/O systems  Systems that need large numbers of external interfaces or parallel channels supported by up to 600 I/O pins.
• On-chip memory intensive designs  Applications that rely on tens of Mbits of embedded RAM for buffering, look-up tables, or state machines.

Unique Advantages

• Massive logic resources: 622,000 logic elements enable consolidation of multi‑module functionalities into a single FPGA, reducing external components.
• Significant embedded RAM: Approximately 51.2 Mbits of on-chip memory supports large buffers and local data storage, improving system latency and throughput.
• High I/O count: 600 I/O pins simplify routing of parallel interfaces and multi-channel I/O without needing external multiplexers.
• Compact FCBGA package: 1517-BBGA (40×40) provides a high-density footprint for space-efficient board designs using surface-mount assembly.
• Commercial temperature rating: Rated 0 °C–85 °C for typical commercial-product deployments and environments.
• RoHS compliant: Meets lead‑free manufacturing requirements for modern PCB assembly processes.

Why Choose 5SGXMA7N3F40C3?

The 5SGXMA7N3F40C3 positions itself as a high-capacity Stratix V GX FPGA tailored for designs requiring very large logic arrays, abundant embedded memory, and extensive I/O. Its commercial-grade operating range and FCBGA package make it appropriate for board-level integration where density and on‑chip resources reduce BOM and simplify system architecture.

Design teams targeting high‑integration digital systems will value the combination of logic scale, memory capacity, and I/O count—backed by the Stratix V family documentation for electrical and switching characteristics—enabling scalable implementations and streamlined development.

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