5SGXMA7N2F40I3LG

The 5SGXMA7N2F40I3LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers very high logic capacity and a large embedded memory complement in a high-pin-count FCBGA package for complex digital systems.

With 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM and 600 I/Os, this device is suited for designs that require substantial logic density, extensive on-chip memory and large peripheral connectivity within an industrial temperature envelope.

Key Features

• Core Logic  622,000 logic elements provide a substantial fabric for implementing large-scale digital designs and custom logic functions.
• Embedded Memory  Approximately 51.2 Mbits of total RAM bits for buffering, on-chip data storage and memory-intensive processing tasks.
• I/O Capability  600 programmable I/Os to support extensive external interfaces, parallel buses and high-pin-count systems integration.
• Power Supply  Core supply specified at 820 mV to 880 mV to match required device operating conditions.
• Package & Mounting  1517-BBGA FCBGA package (supplier package 1517-FBGA, 40×40) in a surface-mount format for high-density board designs.
• Temperature Grade  Industrial grade operation with specified operating temperature range from −40 °C to 100 °C.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-density digital processing  Implement complex signal processing, compute-acceleration or algorithmic pipelines leveraging large logic and memory resources.
• High I/O systems  Drive multi-channel interfaces, wide parallel buses or large sensor arrays using the 600 available I/Os.
• Industrial control and automation  Deploy in industrial environments that require an extended operating temperature range and robust on-chip resources.
• System integration and prototyping  Integrate multiple functions on a single FPGA to reduce board-level complexity and consolidate system logic.

Unique Advantages

• High logic capacity: 622,000 logic elements enable large designs without immediate need for multi-FPGA partitioning.
• Significant on-chip memory: Approximately 51.2 Mbits of RAM reduces external memory dependence for many buffering and state-storage needs.
• Extensive I/O availability: 600 I/Os simplify interfacing to multiple peripherals, high-pin connectors and parallel subsystems.
• Industrial temperature support: Rated from −40 °C to 100 °C for deployments in temperature-challenging environments.
• High-density package: 1517-BBGA (40×40) surface-mount package supports compact board layouts and high interconnect counts.
• RoHS compliant: Meets lead-free and restricted substance requirements for regulated designs.

Why Choose 5SGXMA7N2F40I3LG?

The 5SGXMA7N2F40I3LG combines substantial logic resources, large embedded memory and a high I/O count in a robust industrial-grade package from Intel's Stratix V GX family. It is positioned for designs that require consolidated functionality, dense I/O connectivity and reliable operation across a wide temperature range.

For engineering teams building complex digital systems, this FPGA delivers the on-chip resources to reduce external components and simplify system architectures while providing the package density and environmental range needed for industrial applications.

If you would like pricing, availability or to request a quote for the 5SGXMA7N2F40I3LG, submit an inquiry to purchase or learn more about this Stratix V GX FPGA.