5SGXMA7N2F40I2WN

The 5SGXMA7N2F40I2WN is a high-density Stratix® V GX field programmable gate array (FPGA) manufactured by Intel. It delivers a large logic fabric and substantial on-chip RAM for designs that require extensive programmable logic, embedded memory, and high I/O counts.

This device is suited to designs that demand dense logic integration and many external interfaces, with industrial-grade temperature support and a high-pin-count FCBGA package for compact system integration.

Key Features

• Logic Capacity  Approximately 622,000 logic elements to support complex digital designs and large-scale FPGA implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for frame buffers, packet buffering, and intermediate data storage.
• I/O Integration  600 user I/O pins to support high-channel-count interfaces and broad system connectivity.
• Power Supply  Core voltage specified from 870 mV to 930 mV to match platform power-rail requirements.
• Thermal and Quality Grade  Industrial grade device with an operating temperature range of –40 °C to 100 °C for challenging environments.
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package 1517-FBGA (40×40). Surface-mount mounting type for board-level assembly.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic capacity and embedded RAM for complex signal processing, protocol handling, and custom compute blocks.
• High-channel I/O systems  Leverage 600 I/O pins for multi-channel data acquisition, sensor aggregation, or dense interface designs.
• Industrial automation and control  Industrial temperature rating and robust packaging enable deployment in factory-floor control and automation equipment.

Unique Advantages

• High logic integration:  622,000 logic elements reduce the need for multiple devices, simplifying system design and lowering component count.
• Substantial on-chip RAM:  Approximately 51.2 Mbits of embedded memory supports large buffers and on-chip data storage without external memory in many use cases.
• Extensive I/O capability:  600 I/O pins enable direct connection to numerous peripherals and high-channel-count interfaces.
• Industrial temperature range:  Rated from –40 °C to 100 °C for reliable operation in demanding environmental conditions.
• High-pin-count FCBGA package:  1517-BBGA (1517-FBGA, 40×40) offers compact, board-friendly integration for systems requiring many signals and tight PCB layouts.
• Standards-compliant manufacturing:  RoHS compliant to meet regulatory requirements for lead-free assemblies.

Why Choose 5SGXMA7N2F40I2WN?

The 5SGXMA7N2F40I2WN combines a very high logic element count, significant embedded memory, and a large number of I/O pins in a single industrial-grade Stratix V GX FCBGA package. It is appropriate for designs that need dense programmable logic, on-chip buffering, and wide external connectivity while operating across extended temperature ranges.

This device provides a compact, high-capacity platform for engineers designing complex digital systems where integration density, on-board memory, and robust environmental performance are required.

Request a quote or submit a sales inquiry to obtain pricing and lead-time information for the 5SGXMA7N2F40I2WN. Our team can provide availability and support resources to assist with your design planning.