5SGXMA7N2F40I2G

The 5SGXMA7N2F40I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, furnished in a 1517-BBGA (FCBGA) package. It delivers a combination of very large programmable logic capacity, substantial embedded memory, and a high I/O count for demanding, high-density designs.

Key attributes include 622,000 logic element cells, approximately 51.2 Mbits of on-chip RAM, 600 I/O pins, industrial-grade temperature capability, and a low-voltage core supply operating between 870 mV and 930 mV—specifications intended for applications that require integration of large amounts of programmable logic and memory into a single device.

Key Features

• Core Logic  622,000 logic element cells provide substantial configurable logic capacity for complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, tables, and state storage without external memory in many use cases.
• I/O Density  600 general I/O pins enable extensive peripheral, sensor, and interface connectivity directly from the device.
• Power  Core supply voltage range of 0.870 V to 0.930 V to match low-voltage system rails and modern power-optimized designs.
• Package  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40), supporting surface-mount PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet extended-temperature application requirements.
• Regulatory  RoHS compliant.

Unique Advantages

• High logic integration: 622,000 logic element cells allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependency on external memory for many buffering and data-storage needs.
• Extensive external connectivity: 600 I/O pins support rich peripheral and interface routing for systems requiring numerous I/O channels.
• Industrial-grade thermal range: −40 °C to 100 °C operation supports deployment in environments with wide temperature swings.
• Low-voltage core operation: 0.870–0.930 V core supply supports integration into modern low-power system architectures.
• Surface-mount BBGA packaging: 1517-BBGA FCBGA package provides a high-density footprint for space-constrained board designs.

Why Choose 5SGXMA7N2F40I2G?

The 5SGXMA7N2F40I2G positions itself where high logic density, substantial embedded memory, and large I/O capacity are required in a single FPGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived, environmentally demanding deployments that must balance integration and reliability.

This device is appropriate for designers and procurement teams looking to consolidate complex digital functions on a single Intel Stratix V GX device while maintaining a compact board footprint and meeting industrial thermal requirements.

Request a quote or submit an RFQ to receive pricing and availability information for the 5SGXMA7N2F40I2G FPGA.