5SGXMA7N2F40C2WN

The 5SGXMA7N2F40C2WN is a Stratix V GX field programmable gate array (FPGA) from Intel supplied in a 1517-BBGA FCBGA package. It delivers high logic density and substantial on-chip memory with a large I/O complement for complex, I/O-driven designs.

Designed for commercial-grade applications, this device combines approximately 622,000 logic elements with approximately 51.2 Mbits of embedded memory and up to 600 I/O pins, enabling integration of compute, memory, and connectivity within a single FPGA package.

Key Features

• Core Logic: Approximately 622,000 logic elements for implementing large-scale digital designs and custom hardware acceleration.
• Embedded Memory: Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
• I/O Capacity: 600 user I/O pins to support dense external connectivity for peripherals, high-speed interfaces, and multi-channel systems.
• Package & Mounting: 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for board-level integration.
• Power Supply: Core voltage specified from 870 mV to 930 mV to match system power-rail requirements.
• Operating Temperature: Commercial-grade temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• Compliance: RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• High-density digital processing: Use the large pool of logic elements and embedded memory to implement signal processing pipelines, custom accelerators, and complex state machines.
• I/O-intensive systems: Leverage 600 I/O pins to connect multiple external devices, sensors, or interfaces in communication and instrumentation systems.
• Platform and prototype development: Deploy as a platform FPGA for system-level integration and hardware prototyping where flexible reconfiguration and large logic/memory resources are required.

Unique Advantages

• High integration density: Hundreds of thousands of logic elements reduce the need for multiple discrete devices, simplifying board design.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM enables on-chip buffering and data handling, decreasing external memory dependence.
• Large I/O footprint: 600 I/O pins provide the flexibility to interface with numerous external components and high-pin-count connectors.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments and product lines.
• Industry-standard package: 1517-BBGA / 1517-FBGA (40×40) package supports surface-mount assembly for compact, production-ready boards.

Why Choose 5SGXMA7N2F40C2WN?

The 5SGXMA7N2F40C2WN positions itself as a high-density Stratix V GX FPGA option for commercial applications that require large logic capacity, ample embedded memory, and broad I/O connectivity. Its combination of approximately 622,000 logic elements and roughly 51.2 Mbits of on-chip RAM makes it suitable for designs that consolidate multiple functions onto a single programmable device.

With a defined core voltage range and a surface-mount BBGA package, this FPGA suits teams focused on scalable, board-level integration and system consolidation while maintaining RoHS compliance and commercial temperature operation.

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