5SGXMA7N1F45C2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 323 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N1F45C2N – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMA7N1F45C2N is a Stratix V GX family FPGA IC from Intel. As a commercial-grade Stratix V GX device, it provides a large logic fabric, substantial on-chip memory, and extensive I/O in a high-density BGA package for demanding commercial applications.

Key capabilities exposed by the device include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 840 I/O connections, making it suitable for designs that require significant logic density, on-chip RAM, and broad external connectivity while operating within standard commercial temperature and core-voltage ranges.

Key Features

  • Logic Capacity Provides 622,000 logic elements to implement complex custom logic and large-scale programmable functions.
  • Embedded Memory Approximately 51.2 Mbits of on-chip RAM for deep buffering, lookup tables, and state storage.
  • High I/O Count Up to 840 I/O pins to support extensive peripheral and board-level interfacing.
  • Power and Core Voltage Core supply operation specified from 870 mV to 930 mV to match system power-rail planning.
  • Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial environments.
  • Package and Mounting 1932-ball BGA (1932-BBGA, FCBGA / supplier package 1932-FBGA, FC 45×45), surface-mount format for high-density board designs.
  • Series-level transceiver information Stratix V GX devices are offered in transceiver speed grades (series-level) including GX channel options described in the device datasheet.
  • Compliance RoHS compliant.

Unique Advantages

  • Large programmable fabric: 622,000 logic elements provide the capacity for complex, multi-function FPGA designs without external PLD proliferation.
  • Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for buffering and data processing.
  • Broad connectivity: 840 I/O pins enable dense peripheral integration and flexible board partitioning.
  • Compact, high-density packaging: The 1932-ball BGA package enables high pin count in a compact footprint for space-constrained PCB designs.
  • Commercial readiness: Specified operating temperature of 0 °C to 85 °C and RoHS compliance align with standard commercial product requirements.
  • Controlled core supply range: The defined 870 mV–930 mV core voltage range supports predictable power-supply planning and thermal management.

Why Choose 5SGXMA7N1F45C2N?

The 5SGXMA7N1F45C2N positions itself as a high-capacity, commercial-grade Stratix V GX FPGA suitable for complex logic implementations that demand large logic element counts, abundant on-chip RAM, and extensive I/O. Its package and electrical specifications support dense board integration while meeting commercial operating conditions.

This device is appropriate for engineering teams and procurement seeking a Stratix V GX FPGA with clearly defined core-voltage, thermal, and packaging parameters, along with series-level transceiver options documented in the Stratix V family datasheet.

Request a quote or submit an inquiry to obtain pricing and availability for 5SGXMA7N1F45C2N.

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