5SGXMA7N1F45C2LG

The 5SGXMA7N1F45C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC offering high-density programmable logic in a 1932‑BBGA FCBGA package. The device provides 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os, delivered in a surface‑mount, high‑pin‑count package.

Designed for commercial‑grade applications, this Stratix V GX device operates with a core supply range of 0.820–0.880 V and a specified ambient operating temperature range of 0 °C to 85 °C. The Stratix V series includes GX transceiver speed options (including channels up to 14.1 Gbps in available speed grades) for designs that require high‑speed serial links.

Key Features

• Logic Capacity  622,000 logic elements to implement complex custom logic, accelerators, and glue‑logic functions.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for large buffers, FIFOs, and local data storage.
• I/O Density  840 general‑purpose I/Os to support wide parallel interfaces, multiple peripherals, and board‑level connectivity.
• High‑Speed Transceivers (Series)  Stratix V GX devices offer transceiver speed grades, including options up to 14.1 Gbps, for high‑bandwidth serial links (series capability described in the Stratix V device documentation).
• Package and Mounting  1932‑BBGA (FCBGA) surface‑mount package (supplier device package: 1932‑FBGA, FC (45×45)) for compact, high‑pin‑count board designs.
• Power and Thermal  Core supply voltage range 0.820–0.880 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑Speed Serial Communications  Leverage Stratix V GX transceiver options to implement multi‑Gbps serial links and backplane interfaces.
• Custom Logic and Acceleration  Use the large logic and memory resources to implement algorithm accelerators, protocol offload engines, and custom datapaths.
• I/O‑Intensive Systems  High I/O count supports wide parallel buses, multiple peripherals, and complex board‑level interconnects.

Unique Advantages

• High Integration Density: 622,000 logic elements reduce external glue logic and enable complex system functions inside a single device.
• Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering and local data storage, minimizing external memory requirements.
• Extensive I/O Resources: 840 I/Os enable flexible interfacing to sensors, FPGAs, ASICs, and high‑pin‑count peripherals without board rework.
• High‑Pin‑Count Packaging: 1932‑BBGA (FCBGA) allows maximum signal density in a compact footprint for space‑constrained designs.
• Commercial‑Grade Operating Range: Specified 0 °C to 85 °C operation aligns with standard commercial systems and controlled environments.
• RoHS Compliance: Meets regional environmental directives for lead‑free manufacturing and assembly.

Why Choose 5SGXMA7N1F45C2LG?

The 5SGXMA7N1F45C2LG combines high logic density, large embedded memory, and a very high I/O count in a single Stratix V GX FPGA package, enabling consolidation of complex digital functions onto one device. Its surface‑mount 1932‑BBGA package and commercial temperature rating make it suitable for high‑performance, board‑level systems that require substantial programmable logic and abundant I/O without moving to industrial temperature grades.

This device is well suited to design teams that need scalable programmable logic capacity, on‑chip memory for buffering and acceleration, and high‑speed serial options provided by the Stratix V GX family. The combination of density, I/O, and package suitability provides a robust platform for medium‑ to high‑complexity digital designs.

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