5SGXMA7N1F45C1G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 1,722 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N1F45C1G – Stratix® V GX FPGA IC, 622,000 Logic Elements, 51.2 Mbits RAM, 840 I/Os

The 5SGXMA7N1F45C1G is a Stratix V GX field-programmable gate array from Intel, supplied in a 1932‑FBGA (45×45) package for surface-mount assembly. It delivers high on-chip logic density and substantial embedded memory with a commercial temperature grade and a low-voltage core supply.

Designed for designs that require large programmable logic resources, wide I/O connectivity, and integrated memory, this device provides a balanced platform for complex digital systems while following the electrical and switching characteristic guidance described in the Stratix V datasheet.

Key Features

  • Logic resources — 622,000 logic elements to implement large-scale custom logic, datapaths, and control functions.
  • Embedded memory — Approximately 51.2 Mbits of on-chip RAM for buffers, FIFOs, and on-chip data storage.
  • I/O capacity — 840 I/O pins to support dense external connectivity and multi-channel interfaces.
  • Core supply voltage — Low-voltage operation from 870 mV to 930 mV, enabling compatibility with low-voltage system rails.
  • Package & mounting — 1932‑BBGA (FCBGA) supplier package (1932‑FBGA, FC 45×45) designed for surface-mount assembly and high pin-count routing.
  • Temperature and grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial applications.
  • Standards & compliance — RoHS compliant.
  • Documentation coverage — The Stratix V device datasheet includes electrical and switching characteristics, transceiver specifications, and I/O timing guidance to support system-level design and validation.

Typical Applications

  • High-density processing and acceleration — Implement large custom datapaths and hardware accelerators using abundant logic elements and embedded memory.
  • Networking and communications — Support multi-channel interfaces and high I/O counts for network front-end processing and protocol offload; datasheet documentation includes transceiver and I/O timing details.
  • Signal processing and video — Use on-chip RAM and extensive logic resources for buffering, pipeline stages, and real-time signal/video processing tasks.
  • Custom system controllers — Aggregate many peripheral interfaces and control logic on a single FPGA to simplify board-level integration.

Unique Advantages

  • High logic capacity: 622,000 logic elements enable large, complex designs without immediate partitioning across devices.
  • Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for temporary storage and buffering.
  • Extensive external connectivity: 840 I/Os provide flexibility for interfacing to wide buses, multiple transceivers, and dense peripheral arrays.
  • Compact, high-pin-count package: The 1932‑FBGA (45×45) package supports dense routing and high I/O pinout in a single device footprint.
  • Low-voltage core: Core supply range of 0.87–0.93 V fits modern system power architectures and supports power-optimized designs.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose 5SGXMA7N1F45C1G?

This Stratix V GX device from Intel combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a single, surface-mount FCBGA package. It is a practical choice for teams building complex digital systems that require dense logic implementation, extensive on-chip RAM, and broad external interfacing, all within a commercial temperature envelope.

As part of the Stratix V family, the device is documented with electrical, switching, and transceiver characteristics to help engineers integrate it into system designs. Its combination of resources makes it suitable for scalable designs where on-chip integration and board-level consolidation are priorities.

Request a quote or submit an RFQ to evaluate the 5SGXMA7N1F45C1G for your next project and to receive pricing and availability information.

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