5SGXMA7N1F40I2WN

The 5SGXMA7N1F40I2WN is an Intel Stratix V GX family FPGA in a 1517-BBGA FCBGA package, offered in an industrial temperature grade. It integrates a high density of programmable logic and on-chip memory with a wide I/O complement and is intended for designs that require substantial logic capacity and extended operating temperature range.

Key device characteristics include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 600 I/Os, and a specified core supply range of 870 mV to 930 mV. The device is RoHS compliant and supplied in a surface-mount 1517-FBGA (40×40) footprint.

Key Features

• Logic Capacity 622,000 logic elements for high-density programmable logic integration and complex system implementations.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM bits to support large buffering, lookup tables, and state storage.
• I/O Resources 600 general-purpose I/Os to support broad peripheral and high-pin-count system interfacing.
• Transceiver-Class Device Part of the Stratix V GX family with transceiver-oriented architecture and device-level transceiver specifications documented in the datasheet.
• Power and Supply Core supply specified from 870 mV to 930 mV, enabling defined power planning for system design.
• Industrial Temperature Grade Qualified for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Package and Mounting 1517-BBGA FCBGA package, supplier device package 1517-FBGA (40×40); surface-mount mounting type for PCB assembly.
• Regulatory RoHS compliant.

Typical Applications

• High-density logic integration — Implement complex state machines, parallel processing blocks, and extensive custom logic using the device’s large logic element count.
• Large on-chip buffering and memory-driven functions — Leverage approximately 51.2 Mbits of embedded memory for buffering, packet buffering, or lookup tables.
• Systems requiring broad I/O — Use the 600 I/Os for interfacing with high-pin-count peripherals and mezzanine connections.
• Industrial environments — Industrial temperature rating (−40 °C to 100 °C) supports deployment in temperature-challenging applications.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system-level component count.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces the need for external memory in many designs, simplifying BOM and board routing.
• Extensive I/O count: 600 I/Os provide flexibility for parallel interfaces, board-level connectivity, and multi-channel designs.
• Industrial temperature capability: Specified operation from −40 °C to 100 °C for reliable operation in extended-temperature applications.
• Defined core supply window: 870 mV to 930 mV simplifies power-supply selection and thermal/power budgeting.
• RoHS compliant: Meets common lead-free assembly and regulatory requirements.

Why Choose 5SGXMA7N1F40I2WN?

The 5SGXMA7N1F40I2WN delivers a combination of high logic capacity, significant embedded memory, and a large I/O complement in a surface-mount FCBGA package, positioned for designs that require dense programmable logic and robust I/O. Its industrial temperature rating and defined core supply range make it suitable for systems that must operate reliably across a wide thermal range while maintaining power predictability.

This device is appropriate for engineers and system designers seeking to consolidate complex functionality into a single Stratix V GX FPGA with the support of documented device electrical and transceiver characteristics provided in the Stratix V device documentation.

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