5SGXMABK3H40I4N

The 5SGXMABK3H40I4N is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA FCBGA package, designed for high-density, industrial-grade system designs. It integrates 952,000 logic elements and approximately 53 Mbits of on-chip RAM to support large-scale logic, signal processing, and system-aggregation tasks.

With 696 I/Os, an industrial operating temperature range of –40 °C to 100 °C, and a core voltage supply range of 820 mV to 880 mV, this device is intended for applications that require dense logic, significant embedded memory, and a high I/O count in a surface-mount BGA footprint.

Key Features

• Core & Logic  952,000 logic elements (cells) for implementing large, complex logic functions and parallel processing pipelines.
• Embedded Memory  Approximately 53 Mbits of total on-chip RAM to support buffering, lookup tables, and local data storage for high-throughput designs.
• I/O Density  696 I/Os to enable extensive external interfacing and multi-channel connectivity in a single device.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45), designed for surface-mount assembly.
• Power  Core voltage supply specified from 820 mV to 880 mV to match board power-rail planning and power-supply design.
• Temperature Range & Grade  Industrial grade operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS-compliant manufacturing.

Typical Applications

• High-density signal processing  Large logic and embedded RAM support multi-channel digital signal processing pipelines and accelerator functions.
• Networking and communications  High I/O count enables aggregation of interfaces and protocol bridging in network infrastructure equipment.
• Industrial control systems  Industrial temperature rating and robust I/O enable real-time control, motor management, and factory automation tasks.
• Data acquisition and instrumentation  On-chip memory and dense logic allow local buffering, preprocessing, and aggregation of high-channel-count sensor data.

Unique Advantages

• Very high logic capacity: 952,000 logic elements provide the headroom to consolidate complex functions and reduce external component count.
• Significant embedded RAM: Approximately 53 Mbits of on-chip memory reduces dependence on external DRAM for many buffering and scratchpad needs.
• Extensive I/O connectivity: 696 I/Os simplify board-level routing for multi-interface systems and high-channel designs.
• Industrial temperature support: Rated for –40 °C to 100 °C operation, suitable for demanding industrial environments.
• BGA surface-mount package: 1517-BBGA (45×45) footprint supports high pin-count integration in compact PCB layouts.
• Controlled core supply range: 820–880 mV core voltage specification aids in power-supply design and thermal planning.

Why Choose 5SGXMABK3H40I4N?

This Stratix® V GX device combines high logic density, substantial embedded memory, and a large number of I/Os in a single industrial-grade FCBGA package—making it a compelling choice for engineers consolidating complex digital functions onto one FPGA. Its electrical and thermal specifications support robust system designs where integration density and reliable operation across a wide temperature range are required.

Design teams targeting high-channel, compute-intensive, or interface-rich applications will find the device valuable for reducing board-level complexity and supporting scalable system architectures while maintaining RoHS compliance and standard BGA assembly processes.

Request a quote or submit a sales inquiry to learn about availability, pricing, and lead times for the 5SGXMABK3H40I4N. Our team can provide further technical details and support for your design evaluation.