5SGXMABN1F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA

Quantity 980 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMABN1F45C2LN – Stratix® V GX FPGA, 952,000 logic elements, 840 I/O, 1932-BBGA

The 5SGXMABN1F45C2LN is a Stratix® V GX field programmable gate array (FPGA) IC designed for high-density, programmable logic applications. It delivers a large logic capacity and substantial on‑chip RAM in a compact 1932‑BBGA FCBGA package, targeted at commercial temperature‑grade systems.

Key Features

  • Core Logic  952,000 logic elements provide extensive capacity for complex digital designs and high‑levels of logic integration.
  • Embedded Memory  Approximately 53 Mbits of total on‑chip RAM to support large buffering, lookup tables, and state storage within the FPGA fabric.
  • I/O Density  840 device I/Os enable broad connectivity for parallel interfaces, peripherals, and multi‑channel designs.
  • Power Supply  Core voltage supply range of 820 mV to 880 mV for the device core power domain.
  • Package & Mounting  1932‑BBGA, FCBGA (supplier: 1932‑FBGA, FC 45×45) in a surface‑mount footprint for high‑density board designs.
  • Temperature & Grade  Commercial grade with operating temperature from 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • High‑density digital processing  Large logic capacity and on‑chip RAM make this device suitable for complex signal processing and algorithm acceleration implementations.
  • I/O‑intensive interfaces  The 840 I/O count supports designs requiring broad parallel connectivity or multiple peripheral channels.
  • Prototyping and system integration  The Stratix V GX device is appropriate for validating high‑capacity logic architectures and consolidating discrete functions into programmable silicon.

Unique Advantages

  • High logic capacity: 952,000 logic elements enable large-scale function integration and complex system designs on a single device.
  • Substantial embedded RAM: Approximately 53 Mbits of on‑chip memory reduces external memory dependence and simplifies board routing for memory‑centric designs.
  • Extensive I/O availability: 840 I/Os provide flexibility for interfacing multiple subsystems without external multiplexing.
  • Compact, manufacturable package: 1932‑BBGA FCBGA surface‑mount package supports high‑density PCBs while maintaining a defined supplier package footprint (1932‑FBGA, FC 45×45).
  • Commercial temperature grade: Rated 0 °C to 85 °C to match typical commercial system environments.
  • Regulatory compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose 5SGXMABN1F45C2LN?

This Stratix® V GX FPGA offers a combination of significant logic resources, large embedded memory, and extensive I/O in a single commercial‑grade, surface‑mount package. It is well suited to designers seeking to consolidate complex digital functions, support high I/O counts, and minimize external memory dependencies while adhering to commercial temperature requirements.

For teams focused on scalable, high‑capacity programmable solutions, the 5SGXMABN1F45C2LN provides a robust foundation with clear, verifiable specifications for core voltage, package, I/O, and operating range.

Request a quote or submit your purchase inquiry to receive pricing, availability, and lead‑time information for the 5SGXMABN1F45C2LN.

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