5SGXMABN1F45I2LG

The 5SGXMABN1F45I2LG is a Stratix® V GX field-programmable gate array (FPGA) in a 1932-ball FCBGA package designed for high-density, high-throughput FPGA designs. It combines a large logic capacity and substantial on-chip embedded memory with a high I/O count and the Stratix V GX family’s transceiver capability.

Targeted for applications that require substantial programmable logic, extensive on-chip RAM, and broad I/O capability, this industrial-grade device supports core voltage operation between 820 mV and 880 mV and an operating temperature range from −40 °C to 100 °C.

Key Features

• Logic Density  952,000 logic elements (logic cells) provide large-scale programmable logic for complex designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support high-capacity buffering, state storage, and data path staging.
• I/O Capacity  840 device I/Os to accommodate extensive parallel interfaces and board-level routing requirements.
• Transceiver Capability  Part of the Stratix V GX family; Stratix V GX devices include transceiver speed grades up to 14.1 Gbps (as documented in the device datasheet).
• Power and Voltage  Core supply range specified from 820 mV to 880 mV to match platform power-rail requirements.
• Package and Mounting  1932-ball BGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for modern PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-speed serial systems  Designs that require multi-gigabit transceiver capability can utilize the Stratix V GX family transceiver speed grades documented in the datasheet.
• High-density compute and signal processing  Large logic and embedded memory counts enable complex data-paths, DSP pipelines, and hardware accelerators.
• Large I/O interface platforms  Extensive I/O (840 pins) supports systems needing many parallel interfaces, board-level expansion, or wide data buses.
• Industrial systems  Industrial temperature rating (−40 °C to 100 °C) and robust package options make this device suitable for industrial control and communications equipment.

Unique Advantages

• High programmable capacity: 952,000 logic elements provide the headroom for large, feature-rich FPGA designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependencies and simplifies board-level memory architecture.
• Wide I/O count: 840 I/Os permit dense peripheral connectivity and flexible interface routing on compact PCBs.
• Industrial operating range: Rated from −40 °C to 100 °C to meet temperature demands of industrial deployments.
• Compact FCBGA packaging: 1932-ball FCBGA (45×45) offers a high-pin-count footprint in a single-package solution for space-constrained systems.
• Defined core voltage window: 820–880 mV supply range supports predictable power budgeting and thermal design.

Why Choose 5SGXMABN1F45I2LG?

The 5SGXMABN1F45I2LG delivers a combination of large logic capacity, significant embedded memory, and a high I/O count in a single FCBGA package—providing a platform for complex, performance-oriented FPGA designs. Its industrial temperature rating and defined core voltage range make it suitable for systems that require reliable operation across a wide thermal range.

This device fits customers designing dense, high-throughput systems that benefit from integrated memory and extensive I/O, with the flexibility to leverage the Stratix V GX family’s documented transceiver capabilities. Its RoHS compliance and compact package help streamline BOM and board-level integration for industrial projects.

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