5SGXMABN1F45I2N

The 5SGXMABN1F45I2N is an Intel Stratix V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It delivers very high logic density and large on-chip memory with an extensive I/O count, packaged in a 1932-ball FCBGA for surface-mount applications.

Built for designs that require substantial programmable logic, embedded memory, and high-pin-count connectivity, this device is suited to systems that need integrated, scalable FPGA resources within an industrial operating range.

Key Features

• Logic Resources  Approximately 952,000 logic elements for large-scale programmable logic integration and complex SoC-style implementations.
• Embedded Memory  Approximately 53.25 Mbits of embedded memory to support buffering, large state machines, and on-chip data storage.
• I/O Capacity  840 user I/Os provide extensive connectivity for high-pin-count system designs and multiple parallel interfaces.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting for compact board-level integration.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power-rail design requirements.
• Temperature & Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Use the device’s industrial temperature rating, high logic density, and large I/O count for real-time control, PLCs, and factory automation applications.
• High-density Logic and Acceleration  Implement complex custom accelerators and compute pipelines that require hundreds of thousands of logic elements and substantial embedded RAM.
• High-pin-count Interface Hubs  Serve as an interface concentrator or protocol bridge where many parallel I/Os and on-chip memory are needed for buffering and protocol translation.

Unique Advantages

• High logic integration: Large logic element count enables consolidation of multiple functions into a single FPGA, reducing system BOM and board-level complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and stateful processing without external memory.
• Extensive I/O: 840 I/Os accommodate numerous parallel interfaces, sensors, and high-density connectors without additional bridge components.
• Industrial robustness: Rated for -40 °C to 100 °C operation, suitable for equipment deployed in temperature-challenging environments.
• Compact, serviceable package: 1932-ball FCBGA (45×45) surface-mount package balances high pin-count with a compact PCB footprint for space-constrained designs.
• Low-voltage core: 870 mV–930 mV core supply supports modern low-voltage power-rail architectures.

Why Choose 5SGXMABN1F45I2N?

The 5SGXMABN1F45I2N positions itself as a high-density, industrial-grade FPGA option for systems that require abundant programmable logic, significant embedded memory, and very high I/O capacity. Its combination of approximately 952,000 logic elements, roughly 53.25 Mbits of on-chip RAM, and 840 I/Os makes it suitable for consolidating complex functions and reducing external component count.

Designed for engineers and integrators building robust, high-capacity FPGA-based systems, this Stratix V GX device offers a balance of integration, thermal range, and package density that supports long-term deployment and system scalability.

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