5SGXMABN2F45C2LG

The 5SGXMABN2F45C2LG is a Stratix® V GX field programmable gate array (FPGA) from Intel, supplied in a 1932-ball FCBGA package. It delivers very high logic capacity and on-chip memory for demanding, high-density FPGA designs.

Designed for commercial-grade applications, this device combines a large logic element count, substantial embedded RAM, and a high I/O count to support complex custom logic, buffering and high‑port-count interfacing within a surface-mount FCBGA footprint.

Key Features

• High Logic Capacity  Provides 952,000 logic elements suitable for large-scale, complex designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support data buffering, look-up tables, and memory‑intensive functions.
• High I/O Count  Up to 840 I/O pins to accommodate multi-channel interfaces and dense system integration.
• Power and Core Voltage  Core supply range specified at 820 mV to 880 mV for device operation within defined voltage margins.
• Package and Mounting  1932-ball BGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and classified as Commercial grade.
• RoHS Compliant  Device is RoHS compliant for environmental regulation adherence.

Typical Applications

• High-density logic systems  Use the 952,000 logic elements to implement large custom logic blocks and complex state machines within a single device.
• Memory-intensive functions  Leverage approximately 53.25 Mbits of embedded memory for buffering, packet staging, and on-chip data storage.
• High I/O integration  The 840 available I/Os support designs requiring many external interfaces or parallel data paths.

Unique Advantages

• Substantial on-chip resources: High logic element count and large embedded RAM reduce dependence on external components for many complex designs.
• High port capacity: 840 I/O pins make the device well suited for dense connector interfaces and multi-channel systems.
• Compact, board-ready package: 1932-ball FCBGA package provides a high pin-count solution in a compact footprint for surface-mount assembly.
• Commercial temperature specification: Rated 0 °C to 85 °C for standard commercial deployments.
• Low-voltage core operation: Specified core supply range (820–880 mV) aligns with modern low-voltage FPGA power architectures.
• Regulatory compliance: RoHS compliance supports environmentally conscious product design and procurement.

Why Choose 5SGXMABN2F45C2LG?

The 5SGXMABN2F45C2LG delivers a balanced combination of very high logic capacity, substantial embedded memory, and a large I/O count in a single commercial-grade FCBGA package. These characteristics make it suitable for designs that require dense on-chip resources and extensive external interfacing without adding external memory or glue logic.

Backed by Intel's Stratix® V GX family specifications, this device is a fit for engineering and procurement teams targeting scalable, high-capacity FPGA solutions in commercial environments where board-level integration, maintainable thermal conditions, and RoHS compliance are required.

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