5SGXMABN2F45C2N

The 5SGXMABN2F45C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-capacity digital designs. This Stratix V GX device delivers 952,000 logic elements and approximately 53.248 Mbits of on-chip RAM to support large, complex designs that require extensive logic and embedded memory.

With 840 user I/Os, a surface-mount 1932-BBGA (FCBGA) package, and a commercial operating temperature range of 0 °C to 85 °C, this device is targeted at demanding commercial applications that need significant integration of logic, memory, and I/O resources.

Key Features

• Core Logic: 952,000 logic elements provide a high-density programmable fabric for complex logic, state machines, and custom datapaths.
• Embedded Memory: Approximately 53.248 Mbits of total on-chip RAM for large buffers, FIFOs, and data storage within the FPGA fabric.
• I/O Capability: 840 user I/Os to support wide parallel interfaces, multiple high-pin-count peripherals, and extensive board-level connectivity.
• Package & Mounting: 1932-BBGA (FCBGA) surface-mount package (1932-FBGA, FC 45×45) for high-pin-count board designs and reliable SMT assembly.
• Power Supply: Core voltage supply range of 870 mV to 930 mV to match platform power-rail requirements.
• Temperature & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial-environment deployments.
• Design Density Indicator: 359,200 CLB-like resources (as listed) to support large logic block counts and partitioning across the device fabric.
• Regulatory Compliance: RoHS compliant to meet standard lead-free and environmental requirements.

Typical Applications

• High-density digital processing: Use the large logic element count and embedded RAM to implement complex datapaths, algorithm acceleration, and custom processing blocks.
• High-pin-count I/O systems: Leverage 840 I/Os for interfacing to parallel sensors, wide buses, or multiple peripheral domains on a single FPGA.
• Large on-chip buffering: The approximately 53.248 Mbits of embedded memory support substantial buffering and storage for streaming data and packet handling.

Unique Advantages

• High integration density: 952,000 logic elements reduce the need for multiple devices by consolidating large designs into a single FPGA.
• Significant on-chip memory: Approximately 53.248 Mbits of RAM allow for large internal buffers and reduce external memory dependency for many designs.
• Extensive I/O count: 840 I/Os provide design flexibility for complex board-level interconnect and multi-interface implementations.
• Commercial operating range: Rated for 0 °C to 85 °C operation to match a wide set of commercial deployment environments.
• Industry-standard packaging: 1932-BBGA (FCBGA) package supports high-pin-count PCB layouts and standard surface-mount assembly processes.
• RoHS compliant: Environmentally compliant material set simplifies regulatory acceptance in typical commercial product lines.

Why Choose 5SGXMABN2F45C2N?

The 5SGXMABN2F45C2N combines very large logic capacity, substantial embedded memory, and a high I/O count in a single Stratix V GX FPGA package. It is positioned for commercial designs that require consolidation of complex logic, significant on-chip buffering, and broad connectivity while maintaining standard surface-mount packaging and environmental compliance.

This device is well suited to engineering teams seeking a high-density FPGA platform that supports scalable, integrated designs with a focus on logic capacity, embedded RAM, and I/O versatility, backed by the Stratix V device family documentation and electrical characteristic definitions.

Request a quote or submit an inquiry to evaluate 5SGXMABN2F45C2N for your next high-density FPGA design.