5SGXMABN2F45I2

The 5SGXMABN2F45I2 is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1932-BBGA FCBGA package, offering very high logic density and extensive I/O capability. This industrial-grade device provides a large pool of programmable logic and on-chip memory for complex, integration-heavy designs.

Key device attributes include 952,000 logic elements, approximately 53.2 Mbits of embedded memory, 840 I/Os, a 1932-FBGA (45×45) supplier package, surface-mount mounting, an operating voltage range of 870 mV to 930 mV, and an operating temperature range of –40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core Logic 952,000 logic elements for high-density programmable logic and complex system implementation.
• Embedded Memory Approximately 53.2 Mbits of on-chip RAM to support large data buffering, state storage, and algorithm variables.
• High I/O Count 840 I/Os to enable broad peripheral interfacing and channel expansion within a single device.
• Package & Mounting 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact, board-level integration.
• Power Core voltage supply specified from 870 mV to 930 mV to match platform power design constraints.
• Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for extended-temperature applications and environments.
• Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density programmable logic systems — Deploy large custom logic fabrics and complex state machines that require extensive logic resources and embedded RAM.
• I/O-rich interface consolidation — Aggregate multiple peripherals, buses, or high-channel-count interfaces using the device’s 840 I/Os.
• Industrial and embedded platforms — Use in systems that demand operation across an extended temperature range and RoHS compliance for industrial deployment.

Unique Advantages

• High logic capacity: 952,000 logic elements provide headroom for complex designs and feature integration on a single device.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces external memory dependency and simplifies board-level BOM.
• Extensive I/O availability: 840 I/Os enable consolidation of multiple interfaces and flexible system connectivity options.
• Industrial-grade thermal range: –40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact, production-ready package: 1932-FBGA (45×45) surface-mount package supports dense board layouts and automated assembly processes.
• Regulatory compliance: RoHS compliance aligns with modern manufacturing and supply-chain requirements.

Why Choose 5SGXMABN2F45I2?

The 5SGXMABN2F45I2 combines very high logic density, significant on-chip RAM, and a large I/O complement in a production-ready FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding, long-life applications where integration and reliability are priorities.

This device is well suited to system designers seeking to consolidate functionality, reduce external component count, and scale complex FPGA designs while maintaining clear electrical and thermal operating boundaries defined by the part’s supplied specifications.

Request a quote or submit an inquiry to purchase the 5SGXMABN2F45I2 and evaluate its fit for your next high-density FPGA design.