5SGXMABN2F45I2LN

The 5SGXMABN2F45I2LN is an Intel Stratix® V GX field-programmable gate array (FPGA) offered in an industrial temperature grade. This high-density FPGA integrates 952,000 logic elements and approximately 53.25 Mbits of on-chip RAM to support complex digital designs requiring large logic capacity and embedded memory.

Designed for applications that require abundant I/O and advanced packaging, the device is supplied in a 1932-BBGA (FCBGA) package with surface-mount mounting and is RoHS compliant.

Key Features

• Logic Capacity — 952,000 logic elements to implement large-scale digital networks and custom accelerators.
• Embedded Memory — Approximately 53.25 Mbits of total on-chip RAM available for buffering, FIFOs, and scratchpad storage.
• I/O Count — 840 I/O pins to support dense board-level connectivity and multiple parallel interfaces.
• Transceiver Series-Level Capability — Stratix V GX series documentation lists transceiver speed grades up to 14.1 Gbps (series-level specification).
• Power Supply — Core supply range of 820–880 mV to match system power architectures requiring low-voltage core rails.
• Package & Mounting — 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC (45×45)) with surface-mount assembly.
• Operating Range — Industrial temperature grade with operating range of −40°C to 100°C for extended-environment deployments.
• Regulatory — RoHS compliant.

Typical Applications

• High-speed communications — Leverage the Stratix V GX series transceiver speed grades (series-level up to 14.1 Gbps) and high I/O count for serial links and backplane interfaces.
• Data aggregation and packet processing — Large logic capacity and embedded RAM enable complex packet handling, buffering, and protocol processing.
• High-density digital systems — Extensive logic elements and 840 I/Os support multi-channel, multi-protocol system designs and custom hardware accelerators.

Unique Advantages

• High logic density: 952,000 logic elements provide the silicon resources needed for large designs without partitioning across multiple FPGAs.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory requirements and simplifies timing-critical buffering.
• Extensive I/O: 840 I/Os support complex board-level routing and numerous peripheral interfaces from a single device.
• Industrial temperature grade: Rated for −40°C to 100°C operation to meet broader environmental requirements.
• Compact, high-pin-count package: 1932-BBGA (FCBGA) with 45×45 supplier package footprint enables high-density implementations in surface-mount assemblies.
• RoHS compliant: Aligned with environmental regulations for lead-free manufacturing.

Why Choose 5SGXMABN2F45I2LN?

The 5SGXMABN2F45I2LN combines very high logic capacity, substantial embedded RAM, and a large I/O complement in an industrial-grade Stratix V GX device. It is suited to designs that demand consolidated logic resources and extensive on-chip memory while operating across extended temperature ranges.

For engineering teams targeting dense, I/O-rich systems with series-level Stratix V GX transceiver capabilities and a compact 1932-BBGA package, this FPGA offers a clear integration path with verifiable electrical and thermal specifications.

If you would like pricing, availability, or to request a formal quote for 5SGXMABN2F45I2LN, submit a request for quote or RFQ to receive detailed commercial information and lead-time estimates.