5SGXMABN2F45I3LG

The 5SGXMABN2F45I3LG is an Intel Stratix V GX field-programmable gate array (FPGA) offered in an industrial temperature grade. It delivers a large programmable fabric with high I/O count and substantial on-chip memory, packaged in a high-pin-count FCBGA for surface-mount applications.

Electrical and switching characteristics for the Stratix V family—including operating conditions and I/O timing—are documented in the Stratix V device datasheet. This device is intended for designs that require a dense logic fabric, extensive connectivity, and industrial operating range.

Key Features

• Logic Density  Approximately 952,000 logic elements, providing a very large programmable fabric for complex logic integration.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM, suitable for buffering, FIFOs, and embedded data structures.
• High I/O Count  840 I/O pins to support wide parallel interfaces and dense peripheral connectivity.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for board-level assembly.
• Power Supply  Core supply range specified at 820 mV to 880 mV.
• Operating Temperature  Industrial grade rating with specified operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Large programmable systems  Designs that require hundreds of thousands of logic elements and significant on-chip RAM for high-density logic integration.
• High-I/O interface systems  Equipment that needs hundreds of user I/Os for parallel buses, data converters, or dense peripheral aggregation.
• Industrial embedded platforms  Systems operating across −40 °C to 100 °C that require a high-pin-count FCBGA FPGA with extensive memory and logic resources.

Unique Advantages

• High logic capacity: The ~952k logic elements enable implementation of large, complex designs without external glue logic.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory reduces reliance on external memory for intermediate buffering and data storage.
• Extensive I/O connectivity: 840 I/Os provide flexibility for parallel interfaces and high-pin-count systems.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for deployment in industrial environments.
• High-pin-count FCBGA packaging: 1932-ball FCBGA (45×45) enables dense routing and compact board layouts for advanced designs.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose 5SGXMABN2F45I3LG?

The 5SGXMABN2F45I3LG positions itself as a high-density, industrial-grade Stratix V GX FPGA that combines nearly one million logic elements, extensive embedded memory, and a very high I/O count in a 1932-ball FCBGA package. It is suitable for engineers who need a compact, surface-mount solution with the resources to implement large-scale programmable logic and on-chip data storage.

Design teams targeting industrial systems that require robust temperature range, significant on-chip resources, and a high-pin-count package will find this device a practical option. Detailed electrical and switching parameters for the Stratix V family are available in the device datasheet for integration and validation.

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