5SGXMABN2F45I2LNCV

The 5SGXMABN2F45I2LNCV is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1932-ball FCBGA package. It delivers a high-density programmable logic fabric paired with substantial embedded memory and a large I/O count for complex, high-throughput digital designs.

Targeted at industrial temperature applications, this device provides a combination of logic capacity, on-chip RAM, and low-voltage core operation that supports compute-intensive and high-bandwidth system functions where reliability across –40 °C to 100 °C is required.

Key Features

• High-density logic — 952,000 logic elements to implement large-scale digital designs and complex system functions.
• Significant embedded memory — Approximately 53 Mbits of on-chip RAM to support buffering, packet processing, and DSP workloads.
• Extensive I/O — 840 I/Os to enable broad interfacing with high-pin-count systems and multi-channel designs.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C for use in industrial environments.
• Low-voltage core — Core voltage supply range of 820 mV to 880 mV for compatibility with low-voltage system architectures.
• Robust package options — 1932-BBGA (FCBGA) surface-mount package; supplier device package listed as 1932-FBGA, FC (45×45).
• Surface-mount mounting — Designed for modern PCB assembly processes with surface-mount package.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High-speed networking and communications — Large logic capacity and abundant I/O make this FPGA suitable for packet processing, protocol bridging, and data-plane acceleration.
• Data-center acceleration — On-chip memory and dense logic enable implementation of hardware accelerators and custom compute kernels.
• Telecommunications infrastructure — Industrial temperature rating and high I/O count support ruggedized telecom line cards and baseband processing modules.
• High-performance embedded systems — Use in complex control, signal processing, or multi-interface embedded platforms requiring substantial programmable resources.

Unique Advantages

• High-density programmable fabric: 952,000 logic elements provide the capacity for large custom hardware designs without external logic expansion.
• Large embedded memory: Approximately 53 Mbits of on-chip RAM reduces reliance on external memory for buffering and stateful processing.
• Wide I/O availability: 840 I/Os enable direct connectivity to a broad range of peripherals, transceivers, and parallel interfaces.
• Industrial temperature support: Rated operation from –40 °C to 100 °C for deployment in industrial environments.
• Low-voltage core operation: 820–880 mV core supply supports integration into low-voltage power domains.
• Production-ready package: 1932-BBGA FCBGA surface-mount package supports high-density board-level integration.

Why Choose 5SGXMABN2F45I2LNCV?

This Intel Stratix V GX FPGA combines very high logic density, substantial embedded memory, and expansive I/O in a single industrial-grade FCBGA package. It is positioned for system designs that require scalable programmable compute, extensive interfacing, and reliable operation across a broad temperature range.

Designers building high-throughput networking, communication infrastructure, or compute-accelerated embedded systems will find the device’s capacity and package options conducive to integration, while RoHS compliance and surface-mount packaging support modern manufacturing workflows.

Request a quote or submit a pricing request to evaluate the 5SGXMABN2F45I2LNCV for your next high-density FPGA design.