5SGXMABN2F45I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 280 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMABN2F45I2N – Stratix® V GX FPGA, 952,000 logic elements, 840 I/O (Industrial)
The 5SGXMABN2F45I2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. This device provides a high-density programmable logic fabric combined with substantial on-chip memory and a large I/O count for complex system designs.
The device datasheet documents electrical and switching characteristics for Stratix V devices, including transceiver specifications, core and periphery performance, and I/O timing details—information useful when integrating this part into high-capacity programmable designs.
Key Features
- Logic Capacity 952,000 logic elements (logic cells) for implementing large, complex digital designs.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and large on-chip data structures.
- I/O Density 840 general-purpose I/O pins to enable wide parallel interfaces and dense board-level connectivity.
- Package & Mounting 1932-ball BGA (FCBGA) / supplier package listed as 1932-FBGA, FC (45×45); surface-mount package for high-density PCB assembly.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C for deployment in industrial environments.
- Core Voltage Range Core supply voltage specified from 870 mV to 930 mV to guide power-supply design and sequencing.
- Standards & Compliance RoHS compliant, supporting environmental requirements for lead-free assembly.
- Documented Electrical & Switching Characteristics Datasheet coverage includes operating conditions, power consumption, and I/O timing—helpful for signal integrity and power budgeting work.
Typical Applications
- High-density programmable logic systems Leverage the large logic element count and on-chip RAM to implement complex custom logic and accelerated datapaths.
- High I/O and interface aggregation Use the 840 I/Os for applications requiring multiple parallel interfaces or dense board-level connectivity.
- Industrial equipment and control Industrial temperature grading and robust packaging make the device suitable for automation, instrumentation, and industrial control applications.
Unique Advantages
- Extensive logic resources: 952,000 logic elements enable consolidation of large subsystems into a single device, reducing board-level component count.
- Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports data buffering and state storage without relying on external memory.
- High I/O count: 840 I/Os provide flexibility for wide parallel buses, multiple interfaces, or dense sensor/actuator arrays.
- Industrial thermal range: Rated from −40°C to 100°C to meet temperature demands in industrial deployments.
- Package optimized for dense assemblies: 1932-ball FCBGA package (45×45) supports high pin-count connections in compact board layouts.
- RoHS compliant: Supports lead-free manufacturing processes and environmental regulations.
Why Choose 5SGXMABN2F45I2N?
The 5SGXMABN2F45I2N positions itself as a high-capacity Stratix V GX FPGA option for designs that require substantial programmable logic, on-chip memory, and large I/O resources within an industrial temperature envelope. Its documented electrical and switching characteristics make it practical to evaluate power, timing, and I/O behavior early in system design.
This device is suited to engineering teams consolidating complex logic and interfaces into a single FPGA device while maintaining design rigor for industrial operating conditions and RoHS-compliant production.
Request a quote or submit an inquiry to get pricing and availability for 5SGXMABN2F45I2N for your next design project.

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