5SGXMABN2F45I3N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA

Quantity 363 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMABN2F45I3N – Stratix® V GX FPGA, 952,000 logic elements, 840 I/Os

The 5SGXMABN2F45I3N is an Intel Stratix V GX Field Programmable Gate Array (FPGA) in a 1932-BBGA/FCBGA package. It delivers very large logic capacity and extensive I/O connectivity for designs that require substantial on-chip resources and industrial temperature operation.

This device targets designs that need high logic density, large embedded memory, and many I/Os while operating across an industrial temperature range. The accompanying Stratix V device datasheet documents series-level electrical and switching characteristics, including transceiver speed-grade information for Stratix V GX devices.

Key Features

  • Logic Capacity — 952,000 logic elements (cells) to support large-scale digital designs and complex logic implementations.
  • Embedded Memory — Approximately 53.25 Mbits of on-chip RAM (total RAM bits: 53,248,000) for buffering, packet processing, and memory-intensive functions.
  • I/O Density — 840 I/Os to accommodate high-pin-count interfaces and extensive peripheral connectivity.
  • Package and Mounting — 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC (45×45)), surface-mount mounting type for dense board-level integration.
  • Industrial Grade Operation — Specified grade: Industrial with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Core Supply Voltage — Core voltage supply range of 820 mV to 880 mV, consistent with Stratix V device operating conditions.
  • Standards and Compliance — RoHS compliant to support regulatory and environmental requirements.
  • Series-Level Transceiver Capability — Stratix V GX series transceiver speed-grade information is documented in the device datasheet (series-level specification included in the Stratix V documentation).

Typical Applications

  • High-density digital systems — Implement large custom logic blocks, accelerators, and complex state machines using 952,000 logic elements.
  • Memory-intensive designs — Use approximately 53.25 Mbits of embedded RAM for packet buffering, FIFOs, and in-line data processing.
  • High I/O-count systems — Integrate many parallel interfaces, sensors, or external devices with 840 available I/Os.
  • Industrial equipment — Deploy in industrial applications that require a −40 °C to 100 °C operating range and industrial-grade qualification.

Unique Advantages

  • Highly integrated resource set: Large logic element count and substantial embedded RAM reduce the need for external logic and memory, simplifying system BOM and board area.
  • Extensive I/O capacity: 840 I/Os provide flexibility to support multiple interfaces and parallel connections without extensive multiplexing.
  • Industrial temperature capability: Specified for −40 °C to 100 °C operation to meet thermal requirements of industrial deployments.
  • Compact high-pin package: 1932-BBGA/FCBGA package and surface-mount mounting enable high-density PCB designs while providing large resource counts.
  • Controlled core supply: Narrow core voltage window (820–880 mV) supports predictable power delivery and thermal planning.
  • Regulatory compliance: RoHS compliance supports environmentally conscious system design and regulatory needs.

Why Choose 5SGXMABN2F45I3N?

The 5SGXMABN2F45I3N combines very large logic capacity, substantial embedded memory, and a high I/O count in a dense 1932-ball BGA package, making it suitable for demanding industrial designs that require on-chip resources and robust thermal performance. It is positioned for customers who need to consolidate functionality onto a single FPGA while maintaining industrial temperature operation and proven series-level transceiver options documented in the Stratix V datasheet.

This device is appropriate for engineering teams designing complex digital systems, memory-heavy processing pipelines, or high-pin-count interface hubs where integration, predictability of supply voltage, and industrial-grade operating range are key considerations. The datasheet contains further electrical and switching characteristics for system-level qualification and design integration.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the 5SGXMABN2F45I3N.

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