5SGXMABN2F45I3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 363 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMABN2F45I3N – Stratix® V GX FPGA, 952,000 logic elements, 840 I/Os
The 5SGXMABN2F45I3N is an Intel Stratix V GX Field Programmable Gate Array (FPGA) in a 1932-BBGA/FCBGA package. It delivers very large logic capacity and extensive I/O connectivity for designs that require substantial on-chip resources and industrial temperature operation.
This device targets designs that need high logic density, large embedded memory, and many I/Os while operating across an industrial temperature range. The accompanying Stratix V device datasheet documents series-level electrical and switching characteristics, including transceiver speed-grade information for Stratix V GX devices.
Key Features
- Logic Capacity — 952,000 logic elements (cells) to support large-scale digital designs and complex logic implementations.
- Embedded Memory — Approximately 53.25 Mbits of on-chip RAM (total RAM bits: 53,248,000) for buffering, packet processing, and memory-intensive functions.
- I/O Density — 840 I/Os to accommodate high-pin-count interfaces and extensive peripheral connectivity.
- Package and Mounting — 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC (45×45)), surface-mount mounting type for dense board-level integration.
- Industrial Grade Operation — Specified grade: Industrial with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
- Core Supply Voltage — Core voltage supply range of 820 mV to 880 mV, consistent with Stratix V device operating conditions.
- Standards and Compliance — RoHS compliant to support regulatory and environmental requirements.
- Series-Level Transceiver Capability — Stratix V GX series transceiver speed-grade information is documented in the device datasheet (series-level specification included in the Stratix V documentation).
Typical Applications
- High-density digital systems — Implement large custom logic blocks, accelerators, and complex state machines using 952,000 logic elements.
- Memory-intensive designs — Use approximately 53.25 Mbits of embedded RAM for packet buffering, FIFOs, and in-line data processing.
- High I/O-count systems — Integrate many parallel interfaces, sensors, or external devices with 840 available I/Os.
- Industrial equipment — Deploy in industrial applications that require a −40 °C to 100 °C operating range and industrial-grade qualification.
Unique Advantages
- Highly integrated resource set: Large logic element count and substantial embedded RAM reduce the need for external logic and memory, simplifying system BOM and board area.
- Extensive I/O capacity: 840 I/Os provide flexibility to support multiple interfaces and parallel connections without extensive multiplexing.
- Industrial temperature capability: Specified for −40 °C to 100 °C operation to meet thermal requirements of industrial deployments.
- Compact high-pin package: 1932-BBGA/FCBGA package and surface-mount mounting enable high-density PCB designs while providing large resource counts.
- Controlled core supply: Narrow core voltage window (820–880 mV) supports predictable power delivery and thermal planning.
- Regulatory compliance: RoHS compliance supports environmentally conscious system design and regulatory needs.
Why Choose 5SGXMABN2F45I3N?
The 5SGXMABN2F45I3N combines very large logic capacity, substantial embedded memory, and a high I/O count in a dense 1932-ball BGA package, making it suitable for demanding industrial designs that require on-chip resources and robust thermal performance. It is positioned for customers who need to consolidate functionality onto a single FPGA while maintaining industrial temperature operation and proven series-level transceiver options documented in the Stratix V datasheet.
This device is appropriate for engineering teams designing complex digital systems, memory-heavy processing pipelines, or high-pin-count interface hubs where integration, predictability of supply voltage, and industrial-grade operating range are key considerations. The datasheet contains further electrical and switching characteristics for system-level qualification and design integration.
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