5SGXMABN3F45C2LN

The 5SGXMABN3F45C2LN is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1932-BBGA FCBGA package for surface-mount applications. This commercial-grade device delivers high logic density, significant on-chip memory, and extensive I/O capacity for complex digital designs.

The device is designed for engineers requiring a high-capacity FPGA solution: it integrates 952,000 logic elements and approximately 53.25 Mbits of embedded RAM, supports 840 I/O signals, and operates with a core supply range of 820 mV to 880 mV within a commercial temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Capacity — 952,000 logic elements for large-scale programmable logic and complex system integration.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for data buffering, packet processing, and state storage.
• I/O Density — 840 I/O pins to support wide parallel interfaces, high-channel counts, and flexible board-level routing.
• Package & Mounting — 1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC (45×45)) in a surface-mount form factor suitable for compact PCB designs.
• Power — Core voltage supply range of 820 mV to 880 mV to match system power-rail design requirements.
• Temperature & Grade — Commercial-grade device rated for operation from 0 °C to 85 °C.
• Compliance — RoHS-compliant for lead-free manufacturing flows.
• Documentation — Device is part of the Stratix V family; the Stratix V device datasheet provides electrical and switching characteristics for device selection and system design.

Unique Advantages

• High logic density: 952,000 logic elements enable consolidation of large functions and IP blocks onto a single device, reducing BOM and board complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffers, FIFOs, and on-chip data processing without immediate reliance on external memory.
• Extensive I/O capacity: 840 I/O pins allow flexible interfacing with multiple subsystems and high-channel-count peripheral connectivity.
• Compact package: The 1932-BBGA FCBGA (45×45) package provides high-density mounting for space-constrained designs while maintaining routing capability.
• Commercial temperature rating: 0 °C to 85 °C specification aligns with standard commercial and many industrial electronic applications.
• Standards-friendly manufacturing: RoHS compliance supports lead-free assembly and regulatory requirements for many markets.

Why Choose 5SGXMABN3F45C2LN?

The 5SGXMABN3F45C2LN combines very high logic capacity, abundant embedded memory, and a large I/O count in a single Stratix® V GX FPGA package. Its electrical characteristics and package choices make it suitable for designs that require consolidation of complex digital functions and significant on-chip buffering while maintaining a compact PCB footprint.

Designed for commercial-grade applications, this device offers integration and scalability for architects and engineers who need dense programmable logic, sizable embedded RAM, and flexible interfacing options. Documentation for the Stratix V family provides the electrical and switching specifications needed for detailed system-level design and validation.

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