5SGXMABN3F45C3G

The 5SGXMABN3F45C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1932-ball FCBGA package. It delivers very large programmable logic capacity, substantial embedded memory, and a high I/O count for designs that need dense integration on a surface-mount package.

This commercial-grade device is specified with an operating temperature range of 0 °C to 85 °C and a nominal voltage supply window of 820 mV to 880 mV, making it suitable for board-level applications that require high logic density, abundant on-chip RAM, and extensive external connectivity.

Key Features

• Core logic density — 952,000 logic elements provide very large programmable logic capacity for complex designs.
• Embedded memory — Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage.
• High I/O count — Up to 840 I/O pins to accommodate dense external interfaces and connectivity.
• Package and mounting — 1932-BBGA (FCBGA) surface-mount package with supplier device package listed as 1932-FBGA, FC (45×45).
• Power envelope — Specified voltage supply range of 820 mV to 880 mV for core operation.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C.
• Compliance — RoHS compliant for lead-free manufacturing and assembly.
• Documentation — Device electrical and switching characteristics are documented in the Stratix V device datasheet (SV53001-4.1).

Typical Applications

• High-density programmable logic systems — Suitable for designs that require up to 952,000 logic elements and large on-chip memory capacity.
• High I/O connectivity — Use in systems needing extensive external interfaces, leveraging up to 840 I/O pins.
• Board-level, surface-mount deployments — The 1932-BBGA FCBGA package supports compact, high-density PCB integration.

Unique Advantages

• Substantial on-chip resources — Large logic element count combined with approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many functions.
• High interface density — 840 I/Os enable complex peripheral and high-pin-count connectivity without excessive board-level routing compromises.
• Compact board footprint — FCBGA 1932-ball package provides a high-density implementation for space-constrained designs.
• Defined commercial operating range — Clear specification of 0 °C to 85 °C operating temperature and 820–880 mV supply simplifies system-level power and thermal planning.
• Regulatory readiness — RoHS compliance supports lead-free manufacturing requirements.
• Series-level documentation — Stratix V device datasheet provides detailed electrical and switching characteristics to support system design and validation.

Why Choose 5SGXMABN3F45C3G?

The 5SGXMABN3F45C3G positions itself as a high-density Stratix V GX FPGA option for designs demanding very large logic capacity, significant embedded memory, and extensive I/O in a single surface-mount package. Its commercial-temperature rating and defined supply window help designers plan power and thermal solutions with confidence.

This device is well suited for teams developing complex FPGA-based systems where on-chip resources reduce external BOM complexity and where a compact FCBGA package is required. Detailed electrical and switching characteristics are available in the Stratix V device datasheet to support validation and integration.

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