5SGXMABN3F45C2LG

The 5SGXMABN3F45C2LG is a Stratix V GX family FPGA from Intel, offering high logic capacity and extensive I/O in a 1932-ball FCBGA package. This commercial-grade device provides a large pool of programmable logic and embedded RAM to support complex, high-density digital designs.

With a core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C, the device is tailored for applications that require significant on-chip logic and memory resources while maintaining standard commercial thermal and voltage profiles.

Key Features

• Logic Capacity  952,000 logic elements for implementing large-scale digital designs and complex custom architectures.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support buffering, on-chip data storage, and memory-intensive algorithms.
• I/O Resources  840 user I/Os to enable dense external connectivity and broad interfacing options with peripherals and high-pin-count systems.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45); surface-mount mounting for compact board integration.
• Power  Core voltage supply range of 820 mV to 880 mV to match low-voltage FPGA power domains.
• Temperature Grade  Commercial grade with specified operating range from 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and environmental conformance.

Typical Applications

• High-density data processing  Use the large logic array and substantial embedded RAM for packet processing, pattern matching, and hardware-accelerated algorithms.
• Communications and networking  Extensive I/O count supports complex line cards, protocol bridging, and high-channel interfacing requirements.
• Signal processing and instrumentation  On-chip memory and logic resources enable real-time signal conditioning, filtering, and FPGA-based DSP implementations.
• Compute and acceleration  Deploy as a programmable accelerator for specialized workloads that benefit from parallel logic and local memory.

Unique Advantages

• High logic density: 952,000 logic elements let you consolidate large functions on a single device, reducing system complexity and PCB area.
• Substantial embedded memory: Approximately 53 Mbits of on-chip RAM provides the capacity needed for frame buffers, lookup tables, and streaming data buffers without immediate reliance on external memory.
• Large I/O complement: 840 I/Os enable broad external connectivity for multi-channel systems, dense interfacing, and flexible board-level routing.
• Compact high-pin-count package: The 1932-ball FCBGA (45×45) package supports high I/O density while maintaining a surface-mount form factor for modern PCB designs.
• Commercial-temperature operation: Rated 0 °C to 85 °C to match standard commercial deployments and test environments.
• Regulatory compliance: RoHS compliance supports environmentally constrained designs and procurement requirements.

Why Choose 5SGXMABN3F45C2LG?

The 5SGXMABN3F45C2LG positions itself as a high-capacity, commercially graded Stratix V GX FPGA that brings large-scale programmable logic, significant embedded memory, and extensive I/O into a single FCBGA package. It is well suited for designers who need to implement complex, parallel algorithms and dense interfacing while maintaining a standard commercial thermal and power profile.

Backed by Intel's Stratix V family documentation and specification set, this device offers a clear upgrade path within a mature FPGA product family and is appropriate for teams focused on performance-driven digital systems that require on-chip resources and high pin-count packaging.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMABN3F45C2LG and to discuss how it fits your next high-density FPGA design.