5SGXMABN3F45C2N

The 5SGXMABN3F45C2N is a Stratix® V GX family FPGA delivering a high-density programmable fabric for complex digital designs. It integrates 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/O pins in a 1932-BBGA FCBGA package to address demanding, transceiver-capable system requirements.

Designed as a commercial-grade device, this FPGA provides a combination of large logic capacity, substantial on-chip memory, and a high I/O count for applications that require dense integration and scalable programmable resources.

Key Features

• Core & Logic 952,000 logic elements provide extensive programmable logic capacity for large-scale designs and complex state machines.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, caching, and deep pipeline implementations without immediate external memory dependence.
• I/O Density 840 user I/O pins delivered from a high-pin-count package to support dense peripheral connectivity and parallel interfaces.
• Package & Mounting 1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount format for compact, high‑density PCB layouts.
• Power Core supply range of 870 mV to 930 mV, enabling defined power planning for core rails in system power architectures.
• Operating Grade Commercial operating temperature range of 0°C to 85°C to match mainstream enterprise and industrial-adjacent environments.
• Regulatory RoHS compliant for reduced hazardous substances in manufacturing and assembly.

Typical Applications

• High-speed communications and networking — The Stratix V GX family orientation and the device’s high logic and I/O counts support complex protocol processing and interface aggregation.
• Data processing and acceleration — Large logic capacity and significant embedded RAM make the device suitable for on-board data staging, pipeline acceleration, and custom compute blocks.
• Signal processing and video — Dense logic and embedded memory enable real-time DSP, video preprocessing, and multi-channel signal handling.
• Prototyping complex SoC functions — The high programmable capacity and broad I/O facilitate integration of custom peripherals, bridging logic, and system-level emulation.

Unique Advantages

• High programmable capacity: 952,000 logic elements allow implementation of large, complex designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching needs.
• Extensive connectivity: 840 I/O pins in a single package enable wide parallel interfaces and multiple high-density links directly from the FPGA.
• Compact, high-pin-count package: The 1932-BBGA FCBGA (45×45) package balances pin density with PCB real estate for high-performance system boards.
• Defined power envelope: Core voltage range (870 mV–930 mV) simplifies power-supply planning and thermal budgeting for system designers.
• Commercial temperature rating: Specified 0°C to 85°C operating range for deployments in standard commercial environments.

Why Choose 5SGXMABN3F45C2N?

The 5SGXMABN3F45C2N positions itself as a high-density, transceiver-capable Stratix V GX FPGA that combines a large programmable fabric, significant embedded memory, and a high I/O footprint in a single surface-mount FCBGA package. Its specifications support complex digital signal processing, protocol handling, and system integration tasks where logic density and on-chip memory matter.

This device is well suited to design teams and OEMs developing high-performance communications, data processing, and signal-processing systems who require a scalable, verifiable FPGA platform with clear electrical and thermal parameters for system integration and BOM planning.

Request a quote or submit a request for pricing and availability to begin procurement and integrate the 5SGXMABN3F45C2N into your design evaluations.