5SGXMABN3F45C4G

The 5SGXMABN3F45C4G is a Stratix® V GX family FPGA from Intel, engineered for high-density, high-performance programmable logic applications. It combines a very large logic fabric with substantial on‑chip memory and high I/O density in a 1932‑ball FCBGA package, making it suitable for commercial designs that require significant logic resources and connectivity.

Key Features

• Core Fabric  Provides 952,000 logic elements and approximately 359,200 configurable logic blocks (CLBs) to implement large, complex logic designs.
• Embedded Memory  Includes approximately 53.25 Mbits of on‑chip RAM for buffering, packet processing, and local data storage.
• I/O Density  Offers 840 I/O pins to support wide parallel interfaces and dense system connectivity.
• Stratix V GX Family Characteristics  Part of the Stratix V GX family; the family documentation lists GX channel transceiver capabilities up to 14.1 Gbps in specific speed grades (refer to the device datasheet for details by speed grade).
• Power  Core voltage supply range of 820 mV to 880 mV to match low‑voltage system architectures.
• Package & Mounting  1932‑BBGA FCBGA package (supplier device package: 1932‑FBGA, FC 45×45) and surface‑mount mounting for compact, high‑pin‑count board designs.
• Temperature & Grade  Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Data Center Acceleration  Large logic capacity and on‑chip memory enable hardware acceleration tasks and custom compute offload in commercial data center systems.
• Networking & Telecom Infrastructure  High I/O count and family transceiver capabilities (see datasheet for supported speed grades) suit packet processing, switching, and interface bridging functions.
• High‑Throughput Signal Processing  Substantial logic and embedded RAM support complex DSP pipelines, FIR filters, and real‑time processing engines.
• Imaging & Video Processing  Dense logic and memory resources allow implementation of multi‑channel video pipelines and image processing algorithms in commercial equipment.

Unique Advantages

• High Logic Capacity: 952,000 logic elements enable implementation of large, multi‑function systems on a single device, reducing board‑level complexity.
• Large Embedded Memory: Approximately 53.25 Mbits of on‑chip RAM minimizes external memory dependence and improves data locality for performance‑sensitive tasks.
• Extensive I/O: 840 I/O pins allow wide parallel interfaces and flexibility in system partitioning and I/O assignment.
• Compact High‑Pin Package: The 1932‑ball FCBGA (45×45) package delivers high interconnect density in a space‑efficient footprint for compact system designs.
• Low‑Voltage Core Operation: Operates between 0.82 V and 0.88 V, enabling integration with modern low‑voltage power architectures.
• Commercial‑Grade Reliability: Rated for 0 °C to 85 °C and RoHS compliant for commercial deployments.

Why Choose 5SGXMABN3F45C4G?

The 5SGXMABN3F45C4G delivers a combination of very high logic capacity, substantial embedded memory, and broad I/O in a single commercial‑grade Stratix V GX FPGA package. This makes it well suited for engineers developing complex, high‑bandwidth systems where on‑chip resources and connectivity reduce system cost and board complexity.

Choose this device for commercial applications that require scalable logic resources, significant on‑chip RAM, and a compact high‑pin‑count package, and refer to the Stratix V GX device datasheet for detailed electrical and transceiver speed‑grade specifications.

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