5SGXMABN3F45I3LG

The 5SGXMABN3F45I3LG is a Stratix® V GX field-programmable gate array (FPGA) in a 1932-ball FCBGA package, optimized for high-density, industrial-grade designs. It provides a large logic fabric and substantial on-chip RAM to support complex digital logic, signal processing, and multi-protocol interfacing.

Designed for industrial-temperature operation, the device combines extensive I/O capacity with low-voltage core operation to address demanding applications that require robust logic capacity and flexible system integration.

Key Features

• Core Logic  952,000 logic elements to implement large, complex designs and high-density processing pipelines.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) for buffers, FIFOs, and algorithmic storage.
• I/O Capacity  840 user I/Os to support extensive peripheral connectivity and multi-board interfacing.
• Power Supply  Core supply range of 820 mV to 880 mV to match low-voltage FPGA power rails.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for elevated-environment reliability.
• Standards & Compliance  RoHS-compliant to support lead-free manufacturing initiatives.
• Series-Level Transceiver Options  The Stratix V family documentation describes GX transceiver speed grades offered across the series (series-level information included in the device datasheet).

Typical Applications

• Industrial Control & Automation  Industrial-temperature operation and high logic density enable complex control algorithms, machine vision preprocessing, and deterministic I/O handling.
• High-Density Networking & Protocol Bridging  Large logic resources and abundant I/Os accommodate packet processing, protocol conversion, and board-level networking functions.
• High-Performance Signal Processing  Substantial embedded RAM and massive logic capacity support real-time DSP, filtering, and algorithm acceleration.
• Multi-Interface System Integration  840 I/Os and the Stratix V family transceiver options make the device suitable for designs requiring numerous high-speed and parallel interfaces.

Unique Advantages

• High Logic Density: 952,000 logic elements let you implement large state machines, accelerators, and custom processors on a single device.
• Significant On-Chip Memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependence and improves data throughput.
• Extensive I/O Count: 840 I/Os simplify board-level integration of multiple interfaces without resorting to external IO expanders.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C for deployments in challenging environmental conditions.
• Compact FCBGA Packaging: 1932-ball FCBGA footprint provides a compact, surface-mount solution for high-density PCB layouts.
• Regulatory Compliance: RoHS-compliant to support modern manufacturing and environmental requirements.

Why Choose 5SGXMABN3F45I3LG?

The 5SGXMABN3F45I3LG positions itself as a high-capacity, industrial-grade FPGA for designs that require large programmable logic, abundant on-chip RAM, and extensive I/O. Its low-voltage core operation and FCBGA packaging make it suitable for dense, power-conscious system designs where board space and integration density matter.

Engineers designing complex signal-processing, networking, or industrial control systems will find the device’s combination of logic capacity, memory, and I/O count well suited to consolidate functions, reduce external component count, and accelerate time to market—backed by the Stratix V series documentation for series-level transceiver and electrical characteristics.

For pricing, availability, or to request a quote for 5SGXMABN3F45I3LG, submit an inquiry to obtain current lead times and ordering information.