5SGXMABN3F45I3N

The 5SGXMABN3F45I3N is an Intel Stratix® V GX field-programmable gate array supplied in a 1932-ball FCBGA package. It delivers a very large programmable fabric with 952,000 logic elements and approximately 53.25 Mbits of embedded memory, plus 840 user I/Os—designed for systems that require dense logic capacity and extensive I/O connectivity in an industrial temperature grade.

Targeted at complex digital designs, this device combines high logic density, substantial on-chip RAM, and a compact surface-mount FCBGA package to support demanding applications where integration, I/O count, and wide operating temperature range matter.

Key Features

• Programmable Logic Capacity 952,000 logic elements provide a large synthesis target for complex algorithms, parallel processing, and multi‑function integration.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without immediate reliance on external memory.
• High I/O Count 840 general-purpose I/O pins enable extensive connectivity to peripherals, high‑pin-count interfaces, and multi‑lane designs.
• Package and Mounting 1932-BBGA (FCBGA, 45×45 mm) surface-mount package offers a high-density footprint suitable for compact, high-pin-count board designs.
• Powering Requirements Core voltage supply range of 820 mV to 880 mV to match system power-rail planning and voltage regulator selection.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, supporting deployment in thermally challenging industrial environments.
• Regulatory Compliance RoHS compliant for conformity with common electronic materials restrictions.

Typical Applications

• High‑performance signal processing — Large logic and memory resources enable complex DSP, packet processing, and multi‑channel data manipulation tasks.
• Network and communications equipment — Extensive I/O count supports dense interface connectivity and board-level aggregation of high‑channel counts.
• Industrial control systems — Industrial temperature rating and robust packaging fit factory automation, motion control, and machine‑level processing.
• Test and measurement instruments — On‑chip RAM and logic density help implement capture buffers, scalable protocol handling, and custom measurement engines.

Unique Advantages

• Large, monolithic programmable fabric: 952,000 logic elements reduce the need to partition designs across multiple FPGAs, simplifying board-level design.
• Significant embedded memory: Approximately 53.25 Mbits of on-chip RAM supports local buffering and state storage, lowering external memory dependency.
• Extensive I/O availability: 840 I/Os enable direct interfacing to many peripherals and parallel interfaces without complex route multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation provides wider environmental tolerance for harsh installations.
• High-density FCBGA packaging: 1932-ball FCBGA (45×45 mm) offers a compact solution for high pin-count designs, facilitating dense board integration.
• Controlled core voltage range: 820–880 mV supply range supports predictable power budgeting and regulator selection for system design.

Why Choose 5SGXMABN3F45I3N?

The 5SGXMABN3F45I3N positions itself as a high-capacity Stratix® V GX device for engineers who need substantial programmable resources, large embedded memory, and very high I/O counts in an industrial-grade package. Its combination of logic density and on‑chip RAM enables consolidation of complex subsystems into a single FPGA footprint, reducing BOM complexity and board area.

Backed by Intel’s Stratix V device family documentation and industrial temperature availability, this part is suited for teams designing scalable, long‑lived systems that require robust thermal tolerance, extensive I/O, and compact high‑pin-count packaging.

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