5SGXMABN3F45C4NCV

The 5SGXMABN3F45C4NCV is a Stratix® V GX series Field Programmable Gate Array (FPGA) from Intel, offered in a 1932-BBGA FCBGA package. This high-density, commercial-grade device provides extensive programmable logic, large on-chip memory, and a high I/O count for complex digital designs.

Engineered for applications that require significant logic capacity and broad I/O connectivity, the device delivers a balance of integration and flexibility while operating within a commercial temperature range and low-voltage core supply.

Key Features

• High Logic Density  952,000 logic elements (LEs) to implement large-scale digital functions and complex algorithms.
• Embedded Memory  Approximately 53.25 Mbits of total on-chip RAM bits for buffering, LUT-based storage, and data processing tasks.
• Extensive I/O  840 user I/O pins to support wide parallel interfaces, multi-lane connectivity, and high-channel-count systems.
• Package and Mounting  1932-BBGA, FCBGA (supplier device package: 1932-FBGA, FC 45×45) in a surface-mount form factor for PCB integration.
• Core Voltage  Low-voltage core supply range from 820 mV to 880 mV to match system power-rail planning and power-delivery design.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliant  Conforms to RoHS requirements for lead-free manufacturing and assembly processes.
• Series Transceiver Capability (Series Data)  As a Stratix V GX family device, the series includes devices with high-speed transceiver support (series documentation references GX channels up to 14.1 Gbps), providing context for high-bandwidth system design.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded RAM for algorithm acceleration, signal processing, and custom compute blocks.
• High-channel I/O systems  Leverage 840 I/Os for multi-lane parallel interfaces, large sensor arrays, or multi-port communication boards.
• Networking and communications (system-level)  The Stratix V GX family’s transceiver capabilities (series-level) and high I/O count suit applications requiring substantial data routing and protocol processing.

Unique Advantages

• Massive programmable fabric: 952,000 logic elements provide the capacity to consolidate multiple subsystems into a single programmable device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 840 I/Os enable broad connectivity options for interfacing with peripherals, ADC/DAC front ends, or parallel bus architectures.
• Commercial-temperature operation: Designed for 0 °C to 85 °C environments common to commercial electronic equipment and systems.
• Compact BGA packaging: 1932-BBGA FCBGA in a 45×45 form factor supports dense PCB layouts while remaining compatible with surface-mount assembly processes.
• RoHS-compliant: Facilitates deployment in lead-free manufacturing flows.

Why Choose 5SGXMABN3F45C4NCV?

The 5SGXMABN3F45C4NCV combines very high logic capacity, significant on-chip memory, and broad I/O in a compact FCBGA package, making it a strong choice for designers who need to integrate large, complex digital functions on a single device. Its commercial-grade temperature rating and RoHS compliance support mainstream electronic product deployment scenarios.

This part is appropriate for engineering teams building systems that demand high integration density and flexible FPGA-based implementation while maintaining standard commercial operating conditions. The device’s specs support scalable designs and can simplify system architecture by reducing external component count.

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