5SGXMABN3F45I3G

The 5SGXMABN3F45I3G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable fabric with substantial embedded RAM and a large I/O count for designs that require significant logic, on-chip memory, and interface density. Specified for industrial temperature operation, this device targets systems where integration of large programmable logic and robust I/O capacity are primary design drivers.

Key Features

• Core Logic  Provides 952,000 logic elements for complex programmable logic implementations and large-scale custom architectures.
• Logic Array Blocks (LABs)  Approximately 359,200 LABs to structure and organize logic resources across the device.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
• I/O Density  Up to 840 I/O pins to support dense external interfacing and multi-channel connectivity.
• Transceiver Capability (Series Detail)  Stratix V GX devices are covered in the device datasheet for transceiver specifications and include GX transceiver speed grades referenced in the datasheet.
• Power Supply  Core voltage operating range specified at 820 mV to 880 mV.
• Package & Mounting  1932-BBGA, FCBGA package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount construction.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Designs that require up to 952,000 logic elements and substantial embedded RAM for complex FPGA-based algorithms and custom datapaths.
• I/O-intensive systems  Platforms that need a large number of external interfaces—this device supports up to 840 I/Os for multi-channel connectivity and broad peripheral integration.
• High-speed serial interfaces  Stratix V GX-family transceiver specifications are documented in the device datasheet for designers implementing high-speed serial links.
• Industrial applications  Industrial temperature range (-40 °C to 100 °C) and industrial grade make the device suitable for deployments that require extended temperature operation.

Unique Advantages

• Substantial programmable capacity: 952,000 logic elements and ~359,200 LABs provide headroom for large designs and system-on-FPGA implementations.
• Large embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces external memory dependence for buffering and on-chip data storage.
• High interface count: 840 I/Os enable dense external connectivity without requiring extensive multiplexing or additional interface chips.
• Industrial readiness: Rated for -40 °C to 100 °C and specified as industrial grade for temperature-sensitive deployments.
• Package options for high-pin density: 1932-BBGA / 1932-FBGA (45×45) packaging provides the pin count and routing area needed for complex board-level designs.
• Standards-aligned environmental compliance: RoHS compliance supports regulatory and assembly requirements.

Why Choose 5SGXMABN3F45I3G?

The 5SGXMABN3F45I3G delivers a high level of programmable logic, embedded memory, and I/O capacity in a single Stratix V GX device. Its industrial temperature rating and large package make it a strong option for systems that must combine dense logic resources with broad external connectivity while maintaining operation across extended temperature ranges. For designs that require a scalable, high-capacity FPGA fabric with documented Stratix V GX transceiver and electrical characteristics, this device provides a verifiable specification set to build from.

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