5SGXMABN3F45I4G

The 5SGXMABN3F45I4G is a Stratix V GX family Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package intended for industrial-grade applications. It delivers a high logic capacity, abundant I/O, and substantial on-chip memory to support complex digital designs.

This device is specified with a core supply range of 820 mV to 880 mV and an industrial operating temperature range of –40 °C to 100 °C, making it suitable for deployment in robust systems that require sustained performance across a wide temperature window.

Key Features

• High-density logic: 952,000 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded memory: Approximately 53.25 Mbits of total embedded RAM bits for on-chip buffering, state storage, and memory-intensive functions.
• Extensive I/O: 840 user I/O pins to support broad peripheral connectivity and system interfacing.
• Industrial operating range: Rated for –40 °C to 100 °C operation for deployment in industrial environments.
• Low-voltage core: Core voltage supply specified from 820 mV to 880 mV.
• Package and mounting: 1932-BBGA (FCBGA) package, surface-mount assembly, supplier package listed as 1932-FBGA, FC (45×45).
• Family-level characterization: Device electrical and switching characteristics adhere to the Stratix V device datasheet covering core, periphery, and transceiver characteristics.
• RoHS compliant: Meets RoHS requirements for restricted substances.

Typical Applications

• High-speed communications and networking: Large logic capacity and family-level transceiver characterization support high-throughput, packet-processing, and switching applications.
• Data center and compute acceleration: Dense logic and substantial embedded RAM enable hardware acceleration of compute workloads and custom datapaths.
• Industrial control and automation: Industrial-grade temperature rating and extensive I/O make the device suitable for complex control systems and sensor/actuator interfacing.

Unique Advantages

• Large programmable fabric: 952,000 logic elements allow integration of multiple functions on a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage, simplifying system design.
• Wide I/O availability: 840 I/O pins enable flexible interfacing to high-pin-count systems and parallel data paths.
• Industrial robustness: Operating across –40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact FCBGA package: 1932-BBGA footprint (45×45 supplier outline) provides a high-pin-count solution in a surface-mount form factor.
• Standards-conscious supply: RoHS compliance aligns with modern environmental and manufacturing requirements.

Why Choose 5SGXMABN3F45I4G?

The 5SGXMABN3F45I4G combines substantial logic density, large embedded RAM, and a high I/O count in a robust industrial-grade Stratix V GX package. Its specifications—952,000 logic elements, approximately 53.25 Mbits of on-chip RAM, 840 I/Os, and a –40 °C to 100 °C operating range—position it for demanding digital signal processing, communications, and compute-acceleration designs where integration and reliability matter.

Designed for engineers and system designers who need scalable on-chip resources and proven family-level electrical and switching characteristics, this FPGA supports complex system integration while helping reduce external component count and board-level complexity.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability information for the 5SGXMABN3F45I4G to support your next high-performance design.