5SGXMABN3F45I4N

The 5SGXMABN3F45I4N is a high-density Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932-ball FCBGA package. It combines 952,000 logic elements and approximately 53.25 Mbits of embedded RAM with up to 840 user I/Os to address complex, I/O‑heavy designs.

Designed for industrial‑grade systems, this surface‑mount FPGA supports an operating temperature range from −40 °C to 100 °C and a core voltage supply range of 820 mV to 880 mV, delivering a platform for scalable, high‑capacity logic and memory integration.

Key Features

• Core Logic  952,000 logic elements provide very high programmable logic capacity for large digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM for buffering, scratchpad memory, and state storage within the FPGA fabric.
• I/O Density  840 user I/Os support extensive external connectivity for multi‑channel interfaces and parallel data paths.
• Package and Mounting  1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45). Surface mount design for standard PCB assembly.
• Power  Core supply voltage specified between 820 mV and 880 mV to match system power‑rail requirements and power‑management design.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C, suitable for systems requiring extended temperature capability.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑density logic implementations  Large FPGA fabrics enable complex state machines, parallel processing blocks, and extensive custom logic integration.
• Memory‑intensive datapaths  On‑chip RAM capacity supports buffering, packet staging, and other memory‑heavy functions inside the FPGA.
• Multi‑I/O systems  High I/O count accommodates designs with multiple external interfaces, parallel buses, and extensive signal routing.
• Industrial temperature environments  Industrial operating range supports deployment in systems exposed to wide temperature variations.

Unique Advantages

• Extensive programmable capacity: 952,000 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM minimizes external memory dependence for many buffering and caching needs.
• High I/O connectivity: 840 I/Os provide flexibility for dense peripheral connectivity and high aggregate bandwidth to external devices.
• Industrial temperature rating: Rated −40 °C to 100 °C for reliable operation in temperature‑challenging deployments.
• Compact FCBGA package: 1932‑ball FCBGA (45×45) enables high pin count in a single package suitable for surface‑mount assembly.
• RoHS compliance: Meets environmental material standards for modern electronics manufacturing.

Why Choose 5SGXMABN3F45I4N?

The 5SGXMABN3F45I4N delivers significant programmable logic capacity, substantial embedded memory, and a very high I/O count in a single industrial‑grade FCBGA package. It is well suited for engineers building large, I/O‑intensive systems that require on‑chip memory and robust temperature performance.

Selecting this device provides a scalable, high‑capacity FPGA foundation that supports consolidation of complex functions onto one device, helping simplify system architecture while maintaining environmental and assembly compatibility.

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