5SGXMABN3F45I3LN

The 5SGXMABN3F45I3LN is an Intel Stratix® V GX field programmable gate array (FPGA) provided in a 1932-BBGA FCBGA package. This industrial-grade device integrates very high logic capacity, extensive on-chip memory, and a large complement of I/O to address dense, high-channel-count digital designs.

With 952,000 logic elements and approximately 53.25 Mbits of embedded RAM, the device is suited to designs that require high integration and large on-chip memory along with low-voltage core operation and extended operating temperature range.

Key Features

• Logic Capacity – 952,000 logic elements for mapping complex digital logic and large-scale custom accelerators.
• Embedded Memory – Approximately 53.25 Mbits of total on-chip RAM for buffering, FIFOs, and state storage without external memory.
• I/O Density – 840 user I/Os to support multi-channel interfaces, large parallel buses, and high-pin-count systems.
• Core Voltage – Low-voltage core supply range from 820 mV to 880 mV to match system power-rail architectures.
• Thermal & Environmental – Industrial-grade operation specified from –40°C to 100°C for deployment in extended-temperature environments.
• Package & Mounting – 1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), surface-mount for compact board integration.
• Device Class – Stratix V GX family characteristics as described in the Stratix V device datasheet, including industry-standard device electrical and switching specifications.

Typical Applications

• High-density signal processing – Large logic and memory resources enable complex DSP pipelines and wide parallel processing.
• Multi-channel I/O systems – Hundreds of I/Os support aggregation of many sensors, transceivers, or parallel data paths.
• Custom accelerator boards – High logic capacity and on-chip RAM support implementation of application-specific compute engines and data movers.
• Industrial control and instrumentation – Industrial temperature grade and high I/O count facilitate rugged control systems and measurement platforms.

Unique Advantages

• High integration density: 952,000 logic elements and substantial on-chip RAM reduce the need for external components and simplify PCB routing.
• Extensive I/O support: 840 I/Os enable direct interfacing to many channels or peripherals without additional I/O expanders.
• Industrial temperature rating: Specified operation from –40°C to 100°C for reliable use in extended-temperature applications.
• Compact FCBGA packaging: 1932-BBGA (45×45) surface-mount package provides a space-efficient footprint for high-density board designs.
• Low-voltage core: 820 mV–880 mV supply range aligns with modern low-voltage power architectures to support system power optimization.

Why Choose 5SGXMABN3F45I3LN?

The 5SGXMABN3F45I3LN positions itself as a high-capacity, industrial-grade Stratix V GX FPGA designed for applications that demand large logic resources, significant embedded memory, and broad I/O capability. Its combination of 952,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 840 I/Os makes it suitable for dense signal processing, custom accelerators, and multi-channel data aggregation.

Engineers and procurement teams seeking a compact FCBGA package with a low-voltage core and wide operating temperature range will find this device appropriate for designs requiring scalability and robustness backed by the Stratix V device family specifications.

Request a quote or submit a pricing inquiry to check availability, lead times, and obtain detailed ordering information for the 5SGXMABN3F45I3LN.